Latest Posts - Page 15
DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
Advanced Packaging Technologies are Key for Semiconductor Innovation
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
Amkor Offers Optical Package Solutions for Multiple Applications
TEMPE, Ariz. December 13, 2018 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test...
Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications
BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with...
The Advanced Packaging Industry is on the Move
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts...
Thermal Metamaterials for Advanced Packaging Applications from Stanford University
Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials...
Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on...
A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope
Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days... Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously...
Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions
I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for...Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of...
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image... Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
The Advanced Packaging Times, they are A-Changing…or Are They?
It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had...