Latest Posts - Page 12
Eutectic Die Attach Optimizes High Power GaN Devices
Details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability StratEdge Corporation, a leader in the...
Samsung VP to Keynote IWLPC
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of...
IFTLE 460: On Lost Years and Gang Bonding for Multi-die Stacking
Is 2020 A Lost Year? I recall, growing up in Hell’s Kitchen in NYC, the old-timers in the neighborhood used...
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
New iterative and deep learning reconstruction algorithms significantly enhance throughput and image quality for ZEISS Xradia Versa and Context microCT...
IFTLE 459: imec Develops Nano-TSV for Heterogeneous Integration
This week we continue our look at ECTC 2020. imec and SPTS Collaborate on Nano-TSV Processes As part of our...
ISES 2020 Highlights Asia’s Advanced IC Packaging and HI Capabilities
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for...
IFTLE 458: The Demise of US Chip-making Accelerates as Intel Falls Further Behind
Back in the late summer of 2018 IFTLE unleashed one of its more sarcastic cartoons to note that GlobalFoundries had...
Technologies Migrate from Both Directions to AP Processes
Advanced packaging (AP) processes are often described as the front-end-like processes that have migrated to traditionally back-end applications for packaging...
The Global Packaging Community Shows up for Virtual ECTC!
The pandemic made this a unique year for ECTC. To my knowledge, it is the first time that the in-person...
TechSearch Presentation Highlights Key Developments in Advanced Packaging
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging...
IFTLE 456: SPIL Fan-out Embedded Bridge (FOEB) Technology
in this week’s post, we continue our look at the 2020 IEEE ECTC virtual conference. Siliconware’s presentation “Scalable Chiplet Package...
Virtual DAC 2020 Addresses Chiplets and Advanced Packaging
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National...
IFTLE 455: Advanced Microelectronics is Coming Home
In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world...
IFTLE 454: TSMC Exhibits Packaging Prowess at Virtual ECTC 2020
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than...
IFTLE 453: No, This Ain’t Your Father’s Microelectronic Packaging
In a recent IMAPS webinar, John Park (Figure 1), product management director of Cadence Design Systems, gave a tutorial entitled...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
Social Distancing Spotlight: ERS Celebrates 50 Years of Thermal Solutions
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
