Latest Posts - Page 11
IFTLE 477: Is the World Dependent on Taiwan for Chips? SMIC Focus on Packaging
The World is Dangerously Dependent on Taiwan for Chips The Taipai Times recently published this position paper (written by reporters...
3D PLUS Contributes to Successful Mars 2020 Mission
Launched in July 2020, NASA’s Mars 2020 mission made its final descent to the Red Planet and successfully landed on...
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...
Doing Business in China: A European Company’s Perspective
China consumes more than 50% of all semiconductors annually. However, with a rapidly growing consumer market, domestic Chinese manufacturers can...
The Big Squeeze – Why OSATs Need to Work Smarter
Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across...
IFTLE 474: EPTC 2020 Highlights; TSMC Packaging in Japan
The annual IEEE Electronics Packaging Technology Conference (EPTC 2020 – Asia’s equivalent to the ECTC) took place virtually in December,...
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image...
IFTLE 472: Qorvo wins SHIP RF Packaging Program; SEMI Working on PLP Standards
Qorvo Begins SHIP RF Packaging Program IFTLE has previously discussed the US State-of-the-art Heterogeneous Packaging and Prototyping (SHIPS) program (see...
Enabling Next Generation of FO-PLP and IC-Substrates
EVATEC AG, a leading supplier of thin film equipment and process solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics applications,...
TechSearch International Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from...
IFTLE 468: Samsung Advanced Packaging at the 2020 Virtual IWLPC
Over its 17 years of existence, the IWLPC has morphed from a conference focused on wafer-level packaging to one basically...
IFTLE 465: Intel Reviews Leading-Edge Packaging Technology
In recent blogs, we have discussed the damage done to Intel’s leading-edge technology reputation by major delays in both their...
Virtual IWLPC Focuses on Panel Level Packaging
The 2020 International Wafer Level Packaging Conference (Virtual IWLPC) brought up the caboose of several weeks of virtual conferences that...
The Softer Side of the IMAPS Symposium
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that...
IFTLE 464: TSMC’s Family of Packaging Technologies Create 3D Fabric
TSMC recently held its 26th annual Technology Symposium, so let’s take a look at the highlights of their presentations focusing...
Snippets from Global SiP Summit at SEMICON Taiwan
I was halfway through my post about my day at Virtual SEMICON Taiwan, when I realized that to do the...
IC Packaging Technologies Contribute to Smaller, Faster, Cheaper Electronic Systems with Longer Battery Life
During in-person and on-line meetings, I often discuss with friends the impressive progress our industry has made in the last...
IFTLE 462: If Not a Node then What?
In the August issue of IEEE Spectrum magazine, Samuel Moore published an article entitled “The Node is Nonsense”. (Note: Samuel...
