Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applic... »
The IEEE S3S Conference (shorthand for the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference; quite a mouthful, I know!) is an annual gathering of an intimate crowd (generally 100-125 attendees) that for 35 years has been the premier meeting of engineers and scientists dedicated to current trends in Silicon-On-Insulators (SOI) technology. A parallel 3D integration track was a... »
Stress Test, noun: “A test designed to assess how well a system functions when subjected to greater than normal amounts of stress or pressure.” [Source: Oxford Dictionaries.] The 27th annual SEMI Advanced Semiconductor Manufacturing Conference was off to the races the week of 16 May 2016 in charming Saratoga Springs, NY, for a three-day meet of invited keynote talks, technical papers, poster... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers. The GEMINI FB XT offers industry leading wafer-to-wafer alignment accuracy, customizable pre- and post-processing c... »
The Saratoga Springs, NY, horse racing season starts in late July, following a racing tradition that dates to the 1860s. That’s a pretty long run indeed, and it’s one of the things, along with the healing spring waters, successful Revolutionary War battle history, and “summering” by well-to-do Boston and New York families, that gives Saratoga its charm. At first glance, Saratoga might be a... »
Advanced packaging, and particularly 3D through silicon via (TSV) integration technologies and the resulting 3D-stacked products, challenge materials and process characterization. For 3D TSV stacking of wafers or dies, die-to-die interconnections like micro solder bumps (e.g. AgSn) and Cu pillars are used. The control of the TSV filling and micro-bump quality is a particular issue. In this present... »
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a Massachusetts-based semiconductor inspection technology intellectual property (IP) portfolio company. Stella Alliance’s patented illumination, auto-focus and image acquisition technology significantly enhances the ability to identify certain critical d... »
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200mm. Key process parameters can be adjusted in a wide range, which makes the sy... »
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas, in 2011, which focused first on what they called “bridge technologies” that leverage existing packaging technologies to meet higher density requirements while waiting for full implementation of 3D ICs. In parallel, the Invensas team worked to optimize interposer and ... »
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