LQDX Divests Aluminum Soldering Business – Mina™ – to Taiyo America Inc.
May 01, 2024 · By LQDX · Press Releases
Latest Posts - Page 42
3D ASIP 2014 Pre-Conference Symposia Place Emphasis on 3D Design Tools and Flow, and Manufacturing Process Technology
As 3D integration processes move into volume manufacturing, the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D...
SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... European 3D TSV Summit: “Smarter System Integration” Theme to Focus on Both Business and Technology
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After... TechSearch International 3D IC Gap Analysis Details Market Growth for 3D ICs and 2.5D Interposers
Major DRAM makers Micron, SK Hynix, and Samsung have announced versions of stacked memory with through silicon vias (TSVs) for... Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory... Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate... Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of... Tessera and Micron Execute Technology and Patent License Agreements
Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to... Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control
Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection... Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing
Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement... SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 –... SUSS MicroTec launches ELD300 Excimer Laser Debonder for 3D Integration
Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... Xcerra™ President and CEO to Join Panel Discussion at Semicon West
Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to... EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution
GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50... SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI... SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2
Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014... Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014... SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
