Siemens and TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry’s Newest Advancements
Sep 27, 2023 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 42
austriamicrosystems Introduces “More Than Silicon” Initiative
austriamicrosystems Full Service Foundry business unit today introduced its “More Than Silicon” initiative, a comprehensive service and technology package that...Dr. Bill Bottoms joins Alchimer Board
Alchimer S.A., provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, announced...IITC Technical Conference Expands Program to include 3D Memory
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...eWLB Manufacturer selects SPTS as a partner for their 300mm Roadmap
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped aElpida, PTI, and UMC Partner on 3D IC Integration Development
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (UMC), have entered into a 3-way cooperation to advance...Strategic Restructuring of the SUSS MicroTec Group
SUSS MicroTec has announced its decision to relocate its Substrate Bonder division...Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
OSEO assigns 9M Euro to support CUIVRE Project
Smart Equipment Technolgy (SET), Replisaurus Mastering, and research partner,
Alchimer signs far-reaching agreement with KPM Tech
In a deal that is expected to generate economical new process options for the 3D integration market,European PRO3D Consortium to Focus on Programming 3D Manycore Architectures
CEA-Leti, coordinator of PRO3D, a European consortium created to program future 3D manycore architectures, announced they've assembled six partners ...
SPTS starts on high: Q4 2009 Orders up
SPP Process Technology Systems Ltd. (SPTS), a subsidiary of Sumitomo Precision Products...Alchimer’s Electrografting Validated by RTI
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, announced that...Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it...SUSS MicroTec sells test division to Cascade Microtech; forges alliance to address 3D TSV test
In a double-barreled press release, SUSS MicroTec announced the sale of its Test Systems Division to Cascade Microtech, Inc., a...IMAPS Global Business Council Announces Fall Progam
Titled "Recovery of the Semiconductor Market.", IMAPS GBC will feature two guest speakers. Andrea Lati, market research analyst for...
Georgia Tech’s Rao Tummala to deliver IWLPC Dinner Keynote
Trend and Progress from ICs to 3D ICs to 3D Systems-on-Wafer
This year's IWLPC dinner keynote address...
A*STAR and EDB launch 3D TSV consortium in Singapore
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), launched a...