SPTS Technologies, Author at 3D InCites

High Productivity UBM/RDL Deposition by PVD for FOWLP Applications

High Productivity UBM/RDL Deposition by PVD for FOWLP Applications

Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a greater number of I/O contacts, at a lower cost. With FOWLP today we have the ability to embed heterogeneous devices including baseband processors, RF transceivers, and power management ICs in mold wafers, thereby enabling the latest generation of ultra-thin w... »

SPTS's Sigma fxP PVD system

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment

NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP PVD system to expand NANIUM’S Fan-out Wafer Lev... »

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, was presented with a Supplier Excellence Award in the ‘Special Achievement’ category at the Analog Devices (NASDAQ: ADI) annual award ceremony held in Hong Kong. The ADI S... »

SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging

SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging

Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial con... »

Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement to acquire SPTS Technologies Group Limited (“SPTS”), a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others. The combined companies’... »

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP physical vapor deposition... »

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI Newport, United Kingdom – June 24, 2014 – SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti... »

SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons

SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons

Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that a leading Chinese wafer level packaging (WLP) supplier to the electronics industry has selected the Omega fxP Etc... »

SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing

SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing

Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etch processing. The new module offers significant advantages over competing systems as well as improved etch rate over the 1st generation Rapier in applic... »

SPTS Ships 1000th DRIE Process Module

SPTS Ships 1000th DRIE Process Module

Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the company had reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. This announcement was made at the SE... »