SPTS News
SPTS Technologies Honored with Queen’s Award for Enterprise in Innovation 2020 for its Mosaic™ fxP Plasma Dicing System
Prestigious Award Recognizes SPTS’s Plasma Dicing Innovation in Advanced Packaging Technologies for the Global Semiconductor Industry NEWPORT, UNITED KINGDOM, 21...
High Productivity UBM/RDL Deposition by PVD for FOWLP Applications
Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a...
Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the...
SPTS Technologies Receives Supplier Excellence Award from Analog Devices
YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier... SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS... Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing
Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement... SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 –... SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI...
SPTS: Blanket Silicon Etch Process for Via Reveal
The blanket silicon etch process performed on the SPTS Rapier XE achieves an etch rate >8.5µm/min, high selectivity (Si:SiO>150:1), and is... SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014... SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor... 