Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques
ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.
“To meet the technical requirements of future microelectronic products, 3D- C architectures using through silicon vias (TSVs) are being employed to overcome scaling limits while delivering better device performance,” stated Kevin Crofton, President of SPTS Technologies and Corporate VP at Orbotech. “SPTS has over 300 DRIE modules being used for advanced packaging applications around the world. Together with Fraunhofer IZM, we aim to develop the techniques needed for cost-effective volume manufacturing of (interposer) and 3D IC devices.”
For the joint development project, Fraunhofer IZM is using SPTS’ Rapier process module to etch a range of silicon features, such as deep cavities and tapered or vertical TSVs with high aspect ratios. Leveraging its multi-process capability, the Rapier is also used for other 3D processes, including blanket Si etching for via reveal, post grind stress relief and general wafer thinning. The Rapier carries SPTS’ endpoint detection (EPD) systems: Claritas™ for etches to stop layers and low exposed areas, and ReVia™, the industry’s only in-situ EPD for via reveal etching, ensuring repeatable and accurate exposure of TSV tips from the wafer back-side, at via densities as low as 0.01%. With the APM CVD chamber, Fraunhofer IZM is benefiting from SPTS’ ability to deposit PECVD SiN/SiO film stacks at <190°C with tunable stress, low electrical leakage and excellent diffusion barrier performance. Both technologies are on the single Versalis fxP platform, saving capex and valuable floor space. The ability to run multiple process recipes inside the same system gives Fraunhofer IZM significant flexibility: a valuable resource when working with clients from diverse sectors including automotive, healthcare and industrial electronics.
Martin Wilke, the expert in plasma etching at Fraunhofer IZM, commented, “Our researchers and customers expect us to use the latest state-of-the-art equipment. The SPTS Versalis fxP system was selected for our cleanroom facility in Berlin as it combines industry leading DRIE and CVD modules on a single platform, with the option to add additional modules as our capacity demands increase. The multi-technology Versalis fxP allowed us to reduce initial capital outlay and therefore cost of ownership, within a small footprint.”
Crofton added, “Fraunhofer IZM is a leading institute with a key competence in wafer level packaging and system integration. By working with renowned R&D institutes who specialize in industry-oriented applied research, we are able to provide our customers with production ready wafer processing solutions that give them competitive advantage and lower their cost of manufacture.”
About SPTS Technologies
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device is produced using Orbotech technology. For more information, visit http://www.orbotech.com/.
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