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SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS...
2015 Industry Outlook: SPTS Predicts its 3D Etch, PVD and CVD will reach HVM
In June 2014, SPTS co-produced a webinar with Ron Huemoeller of Amkor, titled “2.5D and 3D Packaging at the Tipping Point.”... SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014...
SPTS: ReVia Endpoint System
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes... SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
European 3D TSV Summit: Focus on Cost of Ownership
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...Notes from the Exhibition Hall
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and...SPTS – It’s all in the Timing
One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in...SPP/SPTS ships 300mm DRIE tool to CEA-LETI
SPP Process Technology Systems (SPTS) and its parent company
