Brewer Science Unveils Innovative Smart Warehouse Monitor System
Apr 17, 2024 · By Brewer Science · Press Releases
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French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer
GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and... Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
Flanders, New Jersey (February 2, 2015)—Rudolph Technologies, Inc. has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced... Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging
Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier... SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS... IWLPC Best Papers Announced
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were...
Georgia Tech Forms a Panel-based Global Glass Industry Consortium
At the IEEE Global Interposer Technology (GIT2014) Workshop held at Georgia Tech on November 5-7, 2014, Georgia Tech announced the formation... Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs),...
3D ASIP 2014 Covers All the Bases from Design to Applications for Interposer and 3D IC Technologies
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and...
European 3D TSV Summit Committee Announces Keynote Speakers; Pre-Conference Symposium to Focus on the Market
This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can... Nordson DAGE Announces Latest Order for XM8000
Nordson DAGE, a division of Nordson Corporation, is pleased to announce its most recent order from a major customer in... OmniVision Launches Family of High Performance 20+ Megapixel Image Sensors for Flagship Smartphones
OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the OV23850 and OV21840, a... Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs
Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results... 3D ASIP 2014 Pre-Conference Symposia Place Emphasis on 3D Design Tools and Flow, and Manufacturing Process Technology
As 3D integration processes move into volume manufacturing, the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D... SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... European 3D TSV Summit: “Smarter System Integration” Theme to Focus on Both Business and Technology
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After... TechSearch International 3D IC Gap Analysis Details Market Growth for 3D ICs and 2.5D Interposers
Major DRAM makers Micron, SK Hynix, and Samsung have announced versions of stacked memory with through silicon vias (TSVs) for... Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory... Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate... Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of... 