Panel of judges expanded and Reader’s Choice Award added
PHOENIX – May 12, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that Bryan Black, Senior Fellow at AMD, will present this year’s keynote speech at the 2014 3D InCites Awards Breakfast.
Co-hosted by SEMI and TechSearch International, the 3D InCites Awards will be judged by an expanded panel of industry experts from across the 3D IC ecosystem. Additionally, a Reader’s Choice Award will be presented to one winner selected from the pool of nominations. The awards ceremony will take place on Thursday, July 10, from 8-10 a.m. at the Impress Lounge during SEMICON West.
Bryan Black has over 20 years of experience in the semiconductor industry, gained at such notable companies as Motorola, Intel, and AMD. He has done a little of everything, from devices to circuits to microarchitecture to DRAM to test to packaging. Black will discuss the benefits of 3D systems-on-chip (SoC), enabled by 3D ICs.
In an effort to field a panel of judges that is representative of the 2.5D/3D IC ecosystem, this year’s panel has been expanded to include industry, academia, and R&D, as well as experts in design, test, processes, and manufacturing. The panel includes:
- Sitaram Arkalgud, Ph.D., VP of 3D Technology, Invensas Corp.
- Paul Franzon, Alumni Distinguished Professor of ECE, North Carolina State University
- Paul Ho, Director, Laboratory for Interconnect & Packaging, University of Texas at Austin
- Yann Guillou, Business Development Manager, SEMI Europe Grenoble Office
- Erik Jan Marinissen, Principal Scientist, IMEC
- Phil Marcoux, PPM Associates
- Herb Reiter, eda2asic
- Ira Feldman, Principal Consultant, Feldman Engineering Corp.
- Mark Scannell, Director, Business Development Silicon Component Division, Leti
- Paul Siblerud, Founder & CEO, Strategic Tech Analysis
- Larry Smith, Ph.D., Independent Consultant, 3D Integration Technologies
- Urmi Ray, Ph.D., Senior Staff Engineer, Qualcomm
- Peter Ramm, Department Head, Heterogeneous Systems Integration, Fraunhofer EMFT
- Paul Werbaneth, 3D and MEMS Industry Journalist
- M. Juergen Wolf, Head of Division, Wafer Level System Integration, Fraunhofer IZM-ASSID
Detailed judge bios are available here.
The 3D InCites Awards program recognizes achievements to further the commercialization of 2.5D and 3D integration technologies. Awards are presented to companies whose innovative products have contributed significantly to the advancement of through silicon via (TSV) technologies and other processes critical to 2.5D and 3D IC applications. The 2014 3D InCites Awards features an expanded list of award categories, including a “Readers Choice Award,” presented to the winner of the online popular vote. Awards will be presented in the following 2.5D/3D IC categories:
• Design Tools (includes EDA and design-for-test)
• Manufacturing Equipment (includes handling equipment)
• Inspection/Metrology Tools
• Test Tools/Equipment (includes probe cards/testers)
Nominations will be accepted through June 6, 2014. Voting will open June 9 and close July 3, 2014. Program details, nomination criteria, and an online nomination form can be found here on the 2014 3DInCites Awards page. Winners will receive a handsome display award and the right to use the 2014 3D InCites Award identity for their own promotional purposes. Nominees and winners will also be featured in an awards spotlight on www.3DinCites.com.
Proceeds of the 2014 awards program will fund a newly formed 3D InCites STEM Scholarships program, which this year will award a scholarship to a graduate of the SEMI High Tech U Program and contribute to the IEEE Frances B. Hugle Engineering Scholarship fund. SEMI High Tech U introduces high school students to the high-tech industry. The IEEE Frances B. Hugle Engineering Scholarship was established to encourage young women to pursue careers in engineering. The charitable donations are largely made possible by the sponsors of this year’s 3D InCites Awards, including Platinum Sponsor EV Group, and Silver Sponsors Mentor Graphics and Rudolph Technologies.
Sponsorships for the 3D InCites Awards are still available for companies who wish to promote their business through this event. 3D InCites also accepts donations in support of these charities. The 3D InCites STEM Scholarships program is currently in the process of achieving 501(c)(3) nonprofit status, making sponsorships and donations tax deductible for businesses and individuals. For more information, contact awards@3Dincites.com.
About 3D InCites
3D InCites is the fastest-growing online resource devoted exclusively to 2.5D and 3D integration technologies. 3D integration requires open collaboration across the supply chain. Therefore, 3D InCites strives to inform key decision-makers about progress in technology development, design, standards, and infrastructure to realize commercial production of 2.5D and 3D technologies. For more information, visit www.3DinCites.com.
About TechSearch International
TechSearch International, Inc., founded in 1987, is the market research leader specializing in technology trends, microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or www.techsearchinc.com.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster, and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets, and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
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