3D design

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents, a very dedicated crowd of 3D IC developers and users from all over the world got together near San Francisco, for the 12th 3D ASIP conference, which featured, once again, the multi-die IC Design Tutorial. Conference presenters reviewed the progress made in 2015 and discus... »

Path Finding Series Part 3: The Cost of Non-robust Design

Path Finding Series Part 3: The Cost of Non-robust Design

In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s erratic yields can impact the manufacturing environment and cost of a product. A non-robust design will have at least one specification that is skewed away from the specification’s center as shown in Figure 1. But what happens if your design is NOT robust? Does the pro... »

3D ASIP 2014 Sparks Mixed Reactions from the Media

3D ASIP 2014 Sparks Mixed Reactions from the Media

Isn’t it interesting how different people attending the same event can come away with different perspectives? I attended last week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP 2014), and came away feeling euphoric about what the 3D industry has achieved since last 3D ASIP, and all its promise for the future. After following the technology progress and believing in i... »

3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs

3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs

Despite efforts to leverage the one hour time difference from Phoenix to San Francisco to my advantage, I arrived on the scene at the 2014 3D ASIP Conference to find the morning Pre-conference Symposium on (Interposer) and 3D Design Tools and Flows already well underway. My absence did not go un-noticed by the first presenter, Bill Martin, E-System Design, or by the session organizer and fellow 3D... »

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented on 3D IC readiness, I was struck by three observations. First of all, while challenges to 3D commercialization still remain, but they’ve shifted from manufacturing challenges to design and infrastructure challenges. Secondly, high volume manufacturing (HVM) means differen... »

Courtesy of Cadence - 3D By Design

3D By Design: A Blog By and For the 3D Design Community

Earlier this year, I published an open letter to chip and system-level designers regarding 3D integration, suggesting they consider 3D integration technologies as a solution to dealing with the increasing complexity of SoC designs. The post was inspired by my attendance at the Design and Test Europe (DATE 2014) conference, where I moderated a session on system on chip (SoC) design complexity, and ... »

TSensors Summit

Catching Up With Steve Breit, Coventor, at the TSensors Summit

A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23 – 25 October 2013, was a showcase for the ideas and strategies that will lead the electronics industry to produce very high volumes of Microelectromechanical Systems (MEMS)-based sensors for use in new applications likely to enter the market in the coming decade. There are currently ... »

Playing the 3D IC Glad Game

Playing the 3D IC Glad Game

I admit it. I have always been a card-carrying member of the Pollyanna Club. What’s wrong with approaching challenges with optimism? While being realistic about the remaining hurdles to overcome is critical to the 3D IC effort, there’s nothing wrong with a healthy dose of the “Glad Game”  to help us keep our eye on the prize. My good friend and industry colleague, Herb Reiter, recen... »

3D InCites Awards Public Opinion Poll Results Are In!

3D InCites Awards Public Opinion Poll Results Are In!

The public opinion poll closed for the first annual 3D InCites Awards on Wednesday July 3, with over 1350 votes cast for 25 nominees in 5 categories. While this poll only represents one vote in the final tally for the awards, I think it’s worth acknowledging the poll winners themselves. In the 3D Products (Design/Products) category, Xilinx is leading the pack with 78 votes for its Virtex-7 H580T... »

Cielution: CielSpot, CielSpot-CTM, CielMech

Cielution: CielSpot, CielSpot-CTM, CielMech

Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s innovative Cloud based collaboration platform. Users define 3D IC stacking, process and power distribution details at the Cielution online portal to implement complex, but necessary design methodologies with minimal effort. Testimonial “I ... »

Page 1 of 212