TSMC

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote their participation in this year’s event. As heterogeneous integration, fueled by advanced packaging and 3D integration, mov... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »

iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform

iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform

Each year, Apple integrates more and more innovative technologies in its iPhone products. This year, with the new iPhone 7 and its A10 processor, the leading company is the first organization to bring out package-on-package (PoP) wafer-level packaging (WLP) at the consumer scale. Apple underwent a strategic change by selecting TSMC’s new integrated fan-out PoP (inFO-PoP) technology for its new A... »

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP Symposium 2016

After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that this year’s OIP Symposium helped me – right after touring Europe for 3 weeks – to finding my groove again. Allow me to share some of my observations at and thoughts about the Symposium, from my “More-than-Moore EcoSystem builder” perspective. The collaborative innovation programs TSMC ... »

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology used for Apple’s A10® processor packaging. And few results are already available. Indeed System Plus Consulting’s experts propose you to discover a previous of the first conclusions. Featured in the latest Apple iPhone 7®, the Apple A10 processor has high... »

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC had a lot of progress to report and demonstrated that they have a clear vision of the road ahead. As I expressed in previous years’ blogs, I started to get to know TSMC as a formidable competitor when I was marketing ASIC solutions at VLSI Technology. TSMC led the transition fro... »

TSMC’s Grand Alliance: A Powerful EcoSystem

TSMC’s Grand Alliance: A Powerful EcoSystem

On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service, made them the largest wafer supplier to fabless IC ... »

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

Yann Guillou, Membership & Business Development, SEMI Europe, talked with 3D InCites / 3D+ about the upcoming European MEMS Summit 2015, which will be held in Milan, Italy, on 17-18 September. 3D InCites / 3D+: Yann, thank you for taking the time to talk with us today about the European MEMS Summit 2015 SEMI is producing this year in Milan. You have as a theme for the summit Sensing the Planet... »

Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Commercialization: 3 Lessons from MEMS Engineer Forum 2015

Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Commercialization: 3 Lessons from MEMS Engineer Forum 2015

The initial shock of a major earthquake lasts just a short time, tens of seconds, although it can seem forever for those trapped by its shaking. A tsunami wave train lasts minutes to hours before ocean waters re-stabilize after their initial disturbance. But the persistence of radiological disasters is measured in decades.  Decades in which the principles of entropy apply to the dispersion of the... »

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