TSMC

IFTLE 397: Malicious Embedded Chips? And TSMC Rides the Leading Edge

IFTLE 397: Malicious Embedded Chips? And TSMC Rides the Leading Edge

Malicious Embedded Chips in our Mother Boards? Early October brought a report from Bloomberg that I have heard was the top tech story circulating at the DoD and DARPA. For years, articles about counterfeit chips, and our reliance on Asian-made chips – where they could be modified in ways to pass on information or allow hacks – have worried us. Now…. we’ve got something new to worr... »

TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

As I prepared to attend TSMC’s OIP 2018 Forum on October 3, 2018 two emails from TSMC caught my attention. They conveyed the news that TSMC just lowered the entry barrier for SoC design significantly by announcing the OIP Cloud Alliance. This is the latest addition to their four Open Innovation Platform Alliances for EDA, IP, Design Services and Value Chain Aggregators. Having promoted Barcelona... »

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering of more than 2000 attendees at the 2018 TSMC Technology Symposium at the Santa Clara Convention Center. TSMC’s strategy to listen to market needs, analyze how best to meet the requirements and act a... »

IEDM 2017 Looks Way Beyond Moore’s Law

IEDM 2017 Looks Way Beyond Moore’s Law

The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s Law and the ITRS Roadmap. Both were primarily focused on digital functions. However, we all must agree that the real world around us is analog. To allow our electronic devices to better assist us in... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

Fan-out Packaging Confirms its Success Story

Fan-out Packaging Confirms its Success Story

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application? Many important questions face the fan-out packaging indu... »

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote their participation in this year’s event. As heterogeneous integration, fueled by advanced packaging and 3D integration, mov... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »

iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform

iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform

Each year, Apple integrates more and more innovative technologies in its iPhone products. This year, with the new iPhone 7 and its A10 processor, the leading company is the first organization to bring out package-on-package (PoP) wafer-level packaging (WLP) at the consumer scale. Apple underwent a strategic change by selecting TSMC’s new integrated fan-out PoP (inFO-PoP) technology for its new A... »

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

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