An Industry in Flux: Semiconductor Giants Strategize for the Future

All it takes is one look at the recent line-up on IHS iSuppli’s annual Semiconductor company ranking-by-revenue to see change is afoot in the industry, driven by the growing demand for mobile devices and declining demand for PCs and laptops. And overall, iSuppli has downgraded its semiconductor market forecast for 2012; it seems that even the healthy growth in the wireless semiconductor market ... »

Just another 3D Monday

For me, Mondays are about regrouping, getting out of weekend head and into what’s going on in the 3D world. (I confess, I do leave my work at the office!) Mostly I cruise around looking to be inspired. Here’s what was waiting for me today. Symmetry is an online magazine I’ve never heard of before; probably because it’s about particle physics and how it relates to other aspects of life and »

TSMC: Making Headlines and Sparking Debate

I've got two questions for readers, based on recent headlines from TSMC.  First of all, are TSMCs activities in building out capacity for 3D ICs spurring leading Taiwanese assembly and test houses to increase capacity as well? That’s what’s implied in this news item on CENS.com, which reports that ASE, SPIL and Powertech are all investing heavily in 3D IC R&D manufacturing and capacity... »

The Fabless Model will Thrive in the 3D IC World

In the May 15 issue of Future Fab News!, Aaron Hand, contributing editor,  asked for opinions on Mark Bohr’s (Intel) now famous EE Times interview, with Rick Merritt, where he said the fabless model is collapsing and a return to the IDM is inevitable. (I addressed a similar topic a year ago in a post titled Will 3D Integration Keep 2nd Tier Foundries Alive?) So for what it’s worth, here’s m... »

Is TSMC putting all its Eggs (or Apples) in one Basket?

For those of us who attended Doug Yu’s keynote address at the 3D Architectures for Semiconductor Integration and Packaging Conference in December, yesterday’s keynote at IMAPS DPC was, in the words of the immortal George Carlin, “déjà vu all over again”; driving home the message that yes, TSMC intends to provide full 2.5F and 3D service including chip design and fabrication, stacking and »

The Many Dimensions of 3D Adoption

Day Two of 3D ASIP and even though the conference opened with declarations that “3D is here” it’s clear after attending the sessions and hearing what all the presenters have to say, that this is a multi-dimensional situation. First, there are the vendors and suppliers, who have a lot at stake, having invested billions developing processes to get to this point. Then there are the manufacturer... »

The Million Dollar 3D Question

With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some confusion in terminology, leading to confusion in who’s doing what first. First and foremost, the technology Intel claims to have pioneered is 3D transistors, also known generically as FinFets. TSMC has also announced that they will move forward with FinFets. What people need to under... »

Inspiring the Semi Industry’s New Frontier

Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain, as well as new approaches to address this new frontier that inc... »

Jim Walker’s Crystal Ball

Ok, maybe I should say Gartner’s crystal ball, but whenever Jim Walker delivers a presentation based on Gartner research, he always interjects his own personal opinion, which in this industry, is a very brave thing to do. I, for one, appreciate that personal touch because if I’m lucky enough to be in the room, I get some nuggets of information that you can’t get just by reviewing the presen... »

From the DPC: Panelists address burning questions for 3D IC integration

I’m glad I stuck around last evening for the 3D panel discussion on the status of 3D integration technologies, applications and roadmaps. As moderator Phil Garrou pointed out, it offered the opportunity to hear some commentary I might have otherwise missed by only attending the scheduled presentations. As a result, I, and a roomful of active participants, got a peek at the inside track of what... »

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