SEMICON West Navigates Semiconductor Industry Changes
Nov 18, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 8
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President...
GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
Microtech Ventures brings a New MEMS and Sensors Summit to Town
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation...
3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities
Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th...
MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers
San Diego’s Coronado Island Marriott Resort and Spa hosted SEMI’s MEMS and Sensors Executive Congress (MSEC 2019) from Oct 23...
Are You Keeping The World Clean for Your Children and Grandchildren?
Adjusting or repairing some of the sprinkler heads on my lot is a regular Spring duty for me. This year,...
Highlights from EDPS 2019
The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50...
Strategic Materials Conference Focuses on Complex Challenges
Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials...
Reaping the Benefits of a Design and Manufacturing Ecosystem
As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform®...
A Look at US Investments in Heterogeneous Integration
The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of...
The Path to Smarter Fabs
Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components...
The Importance of Fully Characterized Semiconductor Materials
More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated...
How to Transform Innovative Technologies Into Customer-Specific Solutions
Technology innovations don’t reach customers right away. Since 1980 I have observed how our industry has improved key parameters like...
What is Happening to the Memory Market?
Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices...
Advanced SiPs Help More than Moore Reach Maturity
Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old...New Details About More-than-Moore Test Technology Advances
SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in...
SEMICON West Keynotes Look to a Future Beyond Moore’s Law
In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West...
10 Years of Invent, Innovate, Implement at EV Group
Of all the companies that have supported 3DInCites over the past 10 years, none has been more consistently involved, both...
