If a Tree Falls in the Forest, Does it Produce Carbon Dioxide? Mar 24, 2021 · By Dean Freeman · 3D In Context, Blogs
The Importance of Sustainability in Semiconductor Manufacturing Jan 05, 2021 · By Dean Freeman · 3D In Context, Blogs
Another Microelectronics Crisis? The Automotive Chip Shortage and Supply Chains Mar 10, 2021 · By Dean Freeman · 3D In Context
Holy San Francisco Batman, SEMICON West 2021 will be held in December! Feb 25, 2021 · By Dean Freeman · 3D In Context, Blogs
Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?May 15, 2014 · By Herb ReiterYears ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D InterposersApr 29, 2014 · By Francoise von Trapp · 3D Event CoverageWhile GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
A Sneak Peek at IITC and AMC 2014Apr 21, 2014 · By Herb ReiterThe recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
When You Come to a Fork In the Road, Take ItApr 07, 2014 · By Herb ReiterWhen Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I...
Breaking Down Walls between Board, Package, and IC Design StepsMar 23, 2014 · By Herb ReiterMany years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
READY – AIM – FIRE! Predictions for 2.5D ICs in 2014Jan 11, 2014 · By Herb ReiterMajor SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013Nov 11, 2013 · By Herb Reiter · 3D Event CoverageThe 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
Comparing Samsung’s 3D NAND with Traditional 3D ICsAug 16, 2013 · By Herb ReiterAt last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob...