As Semiconductor Spending Explodes,This Sure Feels Like a Super Cycle!
Jun 14, 2021 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 7
IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM design
Years ago, when I gave my first 3D technology presentations, I noticed very different reactions from my diverse audience: The...
3D ASIP 2014: All Aboard the 3D IC Train!
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...
Invitation to Participate in Si2 Survey
Dear Semiconductor / EDA expert, In my role as business development consultant, I, Herb Reiter, am getting involved in many...
IC and System Designers, This Could be the Best Four Hours Spent this Year
Don’t miss a full morning of expert presentations about 3D-IC and Interposer design tools and methodologies! Since 2004, every December RTI...
Kahoots from the IWLPC 3D InCites Panel
Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s...
TSMC’s 2014 Open Innovation Platform Ecosystem Forum
Like many years before, I had the opportunity to attend the annual TSMC Open Innovation Platform Ecosystem Forum in San Jose’s Convention...
The Intel Developer Forum 2014
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have...
Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!
Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in...
Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and...
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
A Sneak Peek at IITC and AMC 2014
The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
When You Come to a Fork In the Road, Take It
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I...
Breaking Down Walls between Board, Package, and IC Design Steps
Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
READY – AIM – FIRE! Predictions for 2.5D ICs in 2014
Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...