Taking Stock of Global Investments in Semiconductor Manufacturing Apr 10, 2024 · By Dean Freeman · 3D In Context, Blogs
Electronics Recycling: There’s Gold in Those Old Electronic Gadgets! Mar 21, 2024 · By Dean Freeman · 3D In Context, Blogs
SEMI’s Strategic Materials Conference Calls for Supply Chain CooperationOct 03, 2018 · By Herb ReiterThe message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the...
SEMICON West Confirms: AI is the New Killer-app for SemiconductorsJul 24, 2018 · By Herb ReiterSEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and...
DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply ChainJul 03, 2018 · By Herb ReiterThis year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175...
2018 TSMC Technology Symposium: Listen – Analyze – ActMay 03, 2018 · By Herb ReiterMay 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional...
Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor DesignApr 19, 2018 · By Herb ReiterOn Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System...
FLEX2018 Shows how 3D Printed Electronics Will Impact Our LivesFeb 28, 2018 · By Herb ReiterIf you drive a late model car, you may be impressed by the many sensors that capture engine conditions, tire...
The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2Jan 15, 2018 · By Herb ReiterPart 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on...
The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1Jan 09, 2018 · By Herb ReiterSeveral years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
IEDM 2017 Looks Way Beyond Moore’s LawJan 03, 2018 · By Herb ReiterThe International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along...
Sir Walter Raleigh towered above the 50th IMAPS SymposiumOct 19, 2017 · By Herb Reiter · 3D Event CoverageAlmost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and...
EDPS 2017: NOT the usual Electronic DESIGN Process SymposiumOct 04, 2017 · By Herb ReiterWhen planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold...
TSMC’s OIP 2017 Symposium Shows The Awesome Power of an EcosystemSep 20, 2017 · By Herb ReiterLast week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara...
IMAPS 2017 SiP Conference Takes on SonomaAug 10, 2017 · By Herb ReiterCalifornia’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses,...
Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging SessionsAug 04, 2017 · By Herb ReiterI am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for...
Mission Impossible? Not for SEMI!Aug 03, 2017 · By Herb ReiterSan Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
DAC 54: From Grey to Colorful and Solutions-minded MessagingJun 28, 2017 · By Francoise von TrappThe 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several...
Will IoT be the Next Killer App for Semiconductors?May 30, 2017 · By Herb ReiterAt the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center....
Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDAApr 18, 2017 · By Herb Reiter · 3D Event CoverageThe keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very...
IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDAApr 11, 2017 · By Herb Reiter · 3D Event CoverageThe WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took...
Highlights of the 23rd TSMC SymposiumMar 21, 2017 · By Herb ReiterOn March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I...