Francoise in 3D

Using 3D Integration to Get the Heat Out

Using 3D Integration to Get the Heat Out

Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25, 2017) devoted its entire R&D segment to explore what is in the works to solve this in a session titled Tackling the Thermal Management Challenge. Chaired by Jean Michailos, STMicroelectronics the session featured the following talks: Integrated and Self-Adaptive Microfluidic... »

Highlights from the 2017 European 3D Summit

Highlights from the 2017 European 3D Summit

The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies being developed to achieve next-generation device requirements. In addition to informative sessions, attendees enjoyed some camaraderie, as we’ve all been meeting for a number of years to get 3D integration off the ground. The highlight ... »

The Edge of 3D: 3D SoC VLSI and Si Photonics

The Edge of 3D: 3D SoC VLSI and Si Photonics

Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways based on the closing remarks I delivered at this year’s well-attended event, which took place January 23-25, 2017 at Minatec Campus in Grenoble. In this post, we’ll take a deeper dive into some of the edgier technologies in development that were presented, and what is ... »

Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging

Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging

In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3... »

2017 European 3D Summit: Making Advanced Packaging Great Again

2017 European 3D Summit: Making Advanced Packaging Great Again

Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow to evolve, the 3D integration conversation hasn’t changed too much over the pas... »

Top Ten Reasons to Attend the 2017 European 3D Summit

Top Ten Reasons to Attend the 2017 European 3D Summit

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV Summit for editions 1-3), and it’s shaping up to be a stellar event. If you are still wavering about attending, here are 3D InCites’ top ten reasons to attend: 10: The opportunity to visit beautiful Grenoble, and taste the local fare with your industry colle... »

Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!

Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!

Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate the “turbulent plane ride” of ramping thermo-compression bonding die attach to volume production just might go down in history as the most talked (and laughed) about incident at the 2016 3D Architectures for Semiconductor I... »

Happy Holidays, from 3D InCites!

Happy Holidays, from 3D InCites!

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What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through silicon vias (TSVs). I’ve been honored to attend the four previous years, and have found the event to consis... »

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development and more about the fun part: how we put these technologies to work for us. As Stefan Finkbeiner, Bosch Sensor Systems so eloquently put it, “Nobody wants to buy an accelerometer anymore, they want a step counter.” So how do we capture the value... »

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