Latest Posts
Talking Nerdy with Exhibitors at IWLPC 2018
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process...
Technical Tidbits from IWLPC and MSEC 2017
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October...
aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies
PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries...
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
SMIC Signs License Agreement For Invensas’ DBI Technology
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image...
UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection...
More-than-Moore 2.5D and 3D SiP Integration
A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available....
European 3D Summit: Putting 3D Packaging To Work
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging...
A Metallization Technology Whose Time Has Come
2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more...
A Perfect Storm is Brewing for Complex Packaging in 2016
If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for...
IC Packaging: An Essential Enabler and Differentiator, Part 2
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest...
aveni: The New Name and Face of Alchimer
I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration...
Amkor Execs Outline Strategy for the Future of Advanced Packaging
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
Omnivision: OV23850 PureCel Image Sensor
OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution...
IMAPS DPC 2015: Has 3D IC Hit a Holding Pattern?
From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015...
