Latest Posts
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
Striking the Right Chord for Chiplet Integration
The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution...
Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by...
The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
Outlook 2017: SoC Goes on a Dielet
It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from...
An Open Letter to Chip and System-level Designers Regarding 3D Integration
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
3D Integration Workshop Faces Reliability Challenges Head On
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about...
Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology
GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach...
ASMC 2013 and 3D IC: Time to Volume, Time to Via
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES,...