Latest Posts - Page 2
Holy San Francisco Batman, SEMICON West 2021 will be held in December!
This past week SEMI announced that SEMICON West 2o21 will be a hybrid affair with both a live conference and...
A Tribute to Herb Reiter, Upon his Retirement
Last week, Herb Reiter shared the sad news with me that it was time for him to listen to his...
EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it...
The TSMC 2020 Virtual Technology Symposium and OIP Ecosystem Forum
Just like most other events that attract a large number of people, TSMC 2020 events were held online too. While...
DAC 2020 Addresses Chiplet Design and Integration
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors...
Virtual DAC 2020 Addresses Chiplets and Advanced Packaging
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National...
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets...
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of...
Modeling, Simulation and Test for Multi-die IC Designs
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys...
Dr. Wally Rhines Talks About the Semiconductor Industry’s Future
As long as the “social distancing” requirement is in force, you won’t see me in person at conferences or any...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
As a Pioneer in EDA, Dr. Mary Jane Irwin Pays it Forward
Tomorrow evening (Nov. 7, 2019), Dr. Mary Jane Irwin will take the stage at a dinner being held in her...
Highlights from EDPS 2019
The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50...
DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively
Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or...
Designing and Integrating MCM/SIP Packages into Systems PCBs
The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of...
Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at...
DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain
This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175...
