Tomorrow evening (Nov. 7, 2019), Dr. Mary Jane Irwin will take the stage at a dinner being held in her...
The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50...
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or...
The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of...
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at...
This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175...
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable...
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that...
It is often claimed that 3D chip stacks offer the potential to meet current and future requirements of digital circuits,...
