TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive Patterning® Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software.

Deca’s tight collaboration with the world’s leading advanced packaging provider, ASE, and the Calibre® platform from Siemens, which is the industry gold standard for design verification, allows end customers to realize the power of Adaptive Patterning. While achieving breakthrough electrical performance, all corners of advanced heterogeneous integration designs are now assured to fall within manufacturing capabilities.

Each APDK bundles the full set of automation, design rules, DRC decks, and templates into a single package, offering a turn-key design flow. Every design is jump-started by a library of templates, while extensive automation guides the designer from initial layout to Adaptive Patterning simulation, and finally through design sign-off using Siemens’ Calibre software. Already delivering results at ASE, APDKs are ushering in a new era of high-density, heterogeneous integration.

Through its OSAT Alliance Program, Siemens Digital Industries Software has joined Deca’s AP Live network, a growing supply chain ecosystem including electronic design automation (EDA) providers and original equipment manufacturers (OEMs). Deca’s AP Studio modules integrate Adaptive Patterning design flows with EDA products from Siemens to provide an integrated design solution with a proven platform. 

“Across the industry, advanced packaging solutions like M-Series are key to continued extension of Moore’s Law. With Adaptive Patterning, we’ve solved the key manufacturing challenges, and now with the release of our first APDKs, we’re tackling the complexity of design. Designers need a full-stack solution to implement new products quickly with high-confidence in the final result, and we believe our APDKs deliver that,” said Craig Bishop, CTO, Deca Technologies.

“ASE’s vision to bring automated design enablement to our customers is being realized through a robust solution that addresses both single chip and heterogeneous integration parameters,” said Rich Rice, Sr. Vice President of Marketing and Technical Promotion, ASE. He continued, “Through ramping M-Series to high volume production, we are consistently achieving outstanding quality while cementing our leadership position in fan-out technology. We are especially pleased that both our designers and customers alike can optimize Deca‘s APDK framework capabilities to deliver next-generation fan-out product designs with predictability and confidence.”

“For years, the industry has trusted Calibre software as its verification sign-off platform. Integrating the Calibre eqDRC and programmable edge-movement capabilities into this new APDK framework helps enable automation and verification of the Adaptive Patterning design flows included within Deca’s AP Studio modules. This can help give designers confidence that first pass success can be achieved,” said Michael Buehler Garcia, Vice President of Calibre Design Solutions Product Management, Siemens Digital Industries Software.


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