The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by...
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end...
Technology is Key With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures...
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
The week of July 10th IMAPS held its now annual reshoring conference jointly with the IPC. The General Chair of...
Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet...
A recent report by Semi Analysis (SA) notes that Intel has backed off on the use of chiplets in its...
While most of us in advanced packaging is familiar with CEA-Leti, CEA-List ( Laboratoire d’Intégration de Systèmes et des technologies)...
The semiconductor industry’s decades-long adherence to Moore’s Law doctrine of doubling transistor counts on monolithic devices every 18 – 24...
Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in...
I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will,...
John Park, product management group director, of Custom IC & PCB Group at Cadence, is a go-to authority on advanced...
SAN DIEGO, CA – December 9, 2022 — Chiplets Shorten Chip Design Cycles. Chiplet Summit opens pre-registration today for its...
There is a general agreement that chiplet systems are the next step in the evolution of designing dense, complicated, and...
Recently, there has been a very healthy discussion on whether Moore’s law is still valid. While the arguments fly from...
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
A recent Wall Street Journal article, The Microchip Era Is Giving Way to the Megachip Age, explains how the chip...
Advances in packaging can improve yield and reduce cost. Can they also reduce the environmental footprint of an electronic device?...
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...