Chiplets

IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization

IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization

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Chiplets: Key Enablers for the Next 10-20 Years

Chiplets: Key Enablers for the Next 10-20 Years

Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies are turning to new architectures using chiplets to achieve the economic advantages lost with expensive monolithic scaling. TechSearch International’s new Advanced Packaging Update (APU) details many advantages of chiplets and pr... »

IFTLE 431: Samsung Qualifies EDA Tools for Multi-die Integration

IFTLE 431: Samsung Qualifies EDA Tools for Multi-die Integration

Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal noise challenges. Advanced packaging technologi... »

IFTLE 430: Exascale Computing in Europe: Leading Edge Packaging is the Key!    

IFTLE 430: Exascale Computing in Europe: Leading Edge Packaging is the Key!    

High-performance computing (HPC) has become an important tool for areas that generate high volumes of data. While today's HPC is already powerful, many scientific and industrial challenges require even more computing power, for instance, drug discovery and material design. Thus, the global drive for exascale (1018) computing. »

IFTLE 127: TSMC’s Next-Gen 3D Technology – N3XT

IFTLE 127: TSMC’s Next-Gen 3D Technology – N3XT

Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC gave a presentation entitled “What Will the Next Node Offer Us?” where he discusses the use of chiplets, 3DICs, and a futuristic technology for the heterogeneous integration of memory and logic called N3XT, noting that this technology will be necessary after 3D in order to combine... »

A Look at US Investments in Heterogeneous Integration

A Look at US Investments in Heterogeneous Integration

The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of private funding. If you are jealously looking at China and the billions of dollars they invest in semiconductors, I recommend you make a closer study of US investments in heterogeneous integration, and specifically DARPA. DARPA Heterogeneous Integration In... »

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence. »

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been waiting for, literally for over a decade. The Foveros Backstory In late 2006, CEO Paul Otellini displayed a 300mm wafer of 80 core microprocessors (Figure 1) and announced that such technology would soon be in production. In 2007 Bryan Black (later of AMD), Morrow and other Intel res... »

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and previously at Semiconductor International from 2007 – 2010 (as PFTLE), I have decided to move my packaging blog, IFTLE, to a new platform. I will be forever indebted to Pete for giving this old school technologist a chance to report on, and share his thoughts on, the world of IC pac... »

Striking the Right Chord for Chiplet Integration

Striking the Right Chord for Chiplet Integration

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signaling ... »

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