Chiplets

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing

First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and previously at Semiconductor International from 2007 – 2010 (as PFTLE), I have decided to move my packaging blog, IFTLE, to a new platform. I will be forever indebted to Pete for giving this old school technologist a chance to report on, and share his thoughts on, the world of IC pac... »

Striking the Right Chord for Chiplet Integration

Striking the Right Chord for Chiplet Integration

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signaling ... »

The 14th 3D ASIP Conference Addresses a Spectrum  of 0pportunities, Part 1

The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from across the supply chain meeting to discuss mar... »

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by Dan Green, DARPA, that if the powers that be had bothered reading to the top of Page 3 of Gordon Moore’s “Crammi... »