Latest Posts - Page 3
IMAPS International Symposium 2021 – It’s Great to be Back!
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so...
IFTLE 498: Sapphire Rapids – Intel Chiplet Architecture Begins
X-FAB – First Foundry to Offer Micro Transfer Printing Before we take a look at Intel’s Sapphire Rapids, a quick...
Understanding the Nuances of Chiplet Design
Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple...
IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration
Moore’s law is increasingly difficult to maintain. With the economics of transistor scaling no longer universally applicable, the industry is...
IFTLE 491: IBM Simplifies Si Bridge Technology
Continuing our coverage of ECTC 2021, let’s take a look at the session on Heterogeneous Integration (HI) using 2.XD/3D packaging,...
Heterogeneous Chiplet Design and Integration
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Die-to-Wafer Bonding Steps into the Spotlight on a Heterogeneous Integration Stage
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence...
Everything’s Coming up Chiplets at the 2021 Global Business Council
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It...
Fine-Pitch 3D Stacked Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision... IFTLE 478: Chiplet Nomenclature; EV Group/ASM Support D2W Hybrid Bonding
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and...
CEA-Leti/Intel Collaboration brings 3D Powerhouses to the Advanced 3D Packaging Table
CEA-Leti and Intel recently announced a new collaboration effort on advanced 3D packaging technologies for processors to advance chip design....
IFTLE 467: More Highlights of IMAPS 2020
Avi Bar Cohen 1946 – 2020 Before we take a look at some interesting papers from the recent IMAPS 2020...
IFTLE 465: AMD’s Bryan Black Opines on Chiplets
In the second great keynote presentation of the Annual IMAPS Symposium a few weeks ago [see IFTLE 465 “ Intel...
IFTLE 450: Chiplet is the New Buzzword but Disintegration is the New Technology
Funny how language works and how new terms enter our lexicon. IFTLE is not a supporter of buzzwords. As a...
IFTLE 449: Advanced Packaging and Chiplets at the IMAPS DPC
ECTC Meeting Goes Virtual For those that have not seen the announcement, the Electronics Component Technology Conference (ECTC) held annually...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another...