Latest Posts - Page 4
IEDM 2019: Innovative Devices for an Era of Connected Intelligence
The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career,...
IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization
In 2017, AMD used chiplets in their “Zen 2” architecture to develop the Epyc server processor “Naples” (Figure 1). AMD...
IFTLE 431: Samsung Qualifies EDA Tools for Multi-die Integration
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial...
IFTLE 430: Exascale Computing in Europe: Leading Edge Packaging is the Key!
Beyond HPC High-performance computing (HPC) has become an important tool for areas that generate high volumes of data. While today’s...
IFTLE 427: TSMC’s Next-Gen 3D Technology – N3XT
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC...
A Look at US Investments in Heterogeneous Integration
The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of...
IFTLE 423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing
It was exactly a year ago that GLOBALFOUNDRIES’ announced that they would no longer be competing in the node scaling...
IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here
At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been...
IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing
First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and...
Striking the Right Chord for Chiplet Integration
The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution...
The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
The Truth About Moore’s Law is Revealed at 3D ASIP 2017
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper....