Latest Posts - Page 15
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image... Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
The Advanced Packaging Times, they are A-Changing…or Are They?
It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had...
MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding...TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages...
What the Heterogeneous Integration Technology Roadmap Will Mean for 2017
While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the... What Will Happen With the Chinese Advanced Packaging Ecosystem?
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report...
SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer...
Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016
I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years...
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...
Executive Viewpoint: The New Advanced Packaging Landscape
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had...
Words of Advice From Successful Women in Advanced Packaging
For the second consecutive year, Beth Keser, Qualcomm, organized and moderated the CMPT Woman’s Panel and Reception as part of...
Convergence on the “Big Five”: Focus on Low-cost Flip Chip
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and...
The Advanced Packaging Industry Reaches its Zenith
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have...
Flip Chip Technology: Which Companies will Invest to Support Growth?
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip... SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related... Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest... TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast...
