SEMICON Europa 2025 Member Preview
Oct 28, 2025 · By Jillian McNichol · 3D Event Coverage
Latest Posts - Page 11
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
GIT 2013: One Silicon Guy’s Perspective
A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?
…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets...
IMAPS International 2013 3D Technology Highlights
Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
3D ICs for High Performance Systems
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and more
I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Probing Questions at the IEEE 3D IC Test Workshop
As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me:...
3D Test Community Addresses Requirements for 3D Volume Production Testing
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
FormFactor Tackles Probe Test for 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
SSEC’s New Chemistry for TSV Reveal
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
Alchimer Streamlines Wet Approach
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development...
SETNA: Atmospheric Plasma Surface Modification
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known...
