VIEW Micro Metrology: Point of View at Device Packaging 2026
Mar 14, 2026 · By VIEW Micro Metrology · 3D Event Coverage
Latest Posts - Page 10
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
3D Integration Workshop Faces Reliability Challenges Head On
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about... Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014
Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging
An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging...
Latest Developments in Cleans for TSVs and Cu Bumps
At IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on...
Magic Chip-powered SuperPoP offers Near-term Alternative to TSVs
When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the...
Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…
True to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State...
The 411 on CEA Leti’s Interposer Roadmap
When is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon,...
2.5D and 3D IC Technologies: Application Ready but Cost Limited?
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
The 2014 European 3D TSV Summit: Get Ready for the Domino Effect
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21...
TSVs for MEMS vs. TSVs for 3D ICS
The 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for...
Wafer Level Packaging and Stacking take Center Stage at Asia Conferences
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
2.5D Interposer Innovations from Silex and eSilicon
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with...
3D ASIP 2013: Jan Vardaman’s 3D Readiness Report Card
While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional...
3D ASIP 2013: Coming Down The Home Stretch to 3D IC Commercialization
For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking...
Si Photonics: 3D ASIP’s Pre-game Show
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
