SEMICON Europa 3D InCites Member Spotlight: What We’re Doing to Shape a Sustainable $1 Trillion Era Dec 05, 2023 · By Francoise von Trapp · 3D Event Coverage
GIT 2013: One Silicon Guy’s PerspectiveNov 25, 2013 · By Mark Scannell A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013Nov 25, 2013 · By Laura Mauer The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVsNov 18, 2013 · By Francoise von Trapp Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013Nov 11, 2013 · By Herb Reiter The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?Nov 08, 2013 · By Francoise von Trapp …For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets...
IMAPS International 2013 3D Technology HighlightsOct 23, 2013 · By Rajiv Roy Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
3D ICs for High Performance SystemsOct 21, 2013 · By Jan Vardaman A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and moreOct 21, 2013 · By Francoise von Trapp I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend...
The Many Flavors of 3D DRAMOct 09, 2013 · By Francoise von Trapp Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC ConferenceOct 07, 2013 · By Francoise von Trapp The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap SymposiumSep 26, 2013 · By Francoise von Trapp I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Probing Questions at the IEEE 3D IC Test WorkshopSep 23, 2013 · By Francoise von Trapp As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me:...
3D Test Community Addresses Requirements for 3D Volume Production TestingSep 13, 2013 · By Francoise von Trapp Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
FormFactor Tackles Probe Test for 3D ICsJul 24, 2013 · By Francoise von Trapp This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
SSEC’s New Chemistry for TSV RevealJul 23, 2013 · By Francoise von Trapp This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?Jul 23, 2013 · By Francoise von Trapp That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
Alchimer Streamlines Wet ApproachJul 22, 2013 · By Francoise von Trapp Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development...
SETNA: Atmospheric Plasma Surface ModificationJul 22, 2013 · By Francoise von Trapp This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known...
Dow Corning offers the Power of Silicone TechnologyJul 22, 2013 · By Francoise von Trapp This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration GrowsJul 22, 2013 · By Francoise von Trapp A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...