Why Optical High-Volume Test is 10x More Challenging than Electrical High-Volume Test At the Si-Photonics Packaging Summit 2026
Oct 07, 2026 · By Chad Wallace · 3D Event Coverage
Latest Posts - Page 11
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
2.5D Interposer Innovations from Silex and eSilicon
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with...
3D ASIP 2013: Jan Vardaman’s 3D Readiness Report Card
While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional...
3D ASIP 2013: Coming Down The Home Stretch to 3D IC Commercialization
For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking...
Si Photonics: 3D ASIP’s Pre-game Show
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
GIT 2013: One Silicon Guy’s Perspective
A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?
…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets...
IMAPS International 2013 3D Technology Highlights
Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
3D ICs for High Performance Systems
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and more
I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Probing Questions at the IEEE 3D IC Test Workshop
As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me:...
3D Test Community Addresses Requirements for 3D Volume Production Testing
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...