SEMICON Europa 3D InCites Member Spotlight: What We’re Doing to Shape a Sustainable $1 Trillion Era Dec 05, 2023 · By Francoise von Trapp · 3D Event Coverage
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D InterposersApr 29, 2014 · By Francoise von TrappWhile GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?Apr 16, 2014 · By Francoise von TrappDue to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool ReadinessApr 03, 2014 · By Francoise von Trapp Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
3D Integration Workshop Faces Reliability Challenges Head OnApr 01, 2014 · By Francoise von TrappThe Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about...
Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014Mar 31, 2014 · By Francoise von TrappDesign and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
A Solder Bump Expert’s Take on the Expanding World of Advanced PackagingMar 21, 2014 · By Francoise von TrappAn interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging...
Latest Developments in Cleans for TSVs and Cu BumpsMar 20, 2014 · By Francoise von TrappAt IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on...
Magic Chip-powered SuperPoP offers Near-term Alternative to TSVsMar 03, 2014 · By Francoise von TrappWhen I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the...
Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…Feb 18, 2014 · By Andrew WalkerTrue to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State...
The 411 on CEA Leti’s Interposer RoadmapFeb 04, 2014 · By Francoise von TrappWhen is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon,...
2.5D and 3D IC Technologies: Application Ready but Cost Limited?Jan 31, 2014 · By Francoise von TrappTwo schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
The 2014 European 3D TSV Summit: Get Ready for the Domino EffectJan 27, 2014 · By Francoise von TrappI just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21...
TSVs for MEMS vs. TSVs for 3D ICSJan 24, 2014 · By Francoise von TrappThe 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for...
Wafer Level Packaging and Stacking take Center Stage at Asia ConferencesJan 16, 2014 · By Rajiv RoyI thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in ActionDec 20, 2013 · By Francoise von TrappIt may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
2.5D Interposer Innovations from Silex and eSiliconDec 20, 2013 · By Francoise von Trapp2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with...
3D ASIP 2013: Jan Vardaman’s 3D Readiness Report CardDec 18, 2013 · By Francoise von TrappWhile other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional...
3D ASIP 2013: Coming Down The Home Stretch to 3D IC CommercializationDec 16, 2013 · By Francoise von TrappFor years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking...
Si Photonics: 3D ASIP’s Pre-game ShowDec 13, 2013 · By Francoise von TrappIs Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
3D TSV without LimitsDec 04, 2013 · By Yann GuillouWhat can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...