Mark Scannell, Author at 3D InCites

Thank 2.5D Interposer Technologies for the Success of 3D ICs

Thank 2.5D Interposer Technologies for the Success of 3D ICs

Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may have been the commercialization of 2.5D interposer technologies? Arguably, 3D and silicon interposer are very different technologies, with a common denominator that happens to be the through silicon via (TSV). Until Xilinx announced its Virtix-7 2000T in or around 2011, s... »

glass Interposer

GIT 2013: One Silicon Guy’s Perspective

A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of the technology introduction another year or two. This is precisely what Phil ‘the Guru’ Garrou did with his market analysis talk at this year’s Global Interposer Technology Workshop (GIT 2013), which I attended last week at Georgia Tech University. Garrou listed ... »