October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global collaboration. From groundbreaking facility announcements and strategic partnerships to prestigious industry recognitions, members continued to push technological and manufacturing boundaries. The month also featured major events, where companies unveiled cutting-edge solutions in hybrid bonding, chiplet integration, and sustainability-driven manufacturing. With continued momentum in workforce development, international investment, and next-generation materials, October underscored the industry’s collective drive to shape a smarter, more connected semiconductor future.
Technology and Innovation
Siemens announced enhancements to its Innovator3D IC solution suite, designed to simplify the development of chiplet-based semiconductor packages exceeding 50 million pins. The platform integrates AI-driven functionality, multithreading, and multicore capabilities to improve efficiency in authoring, simulating, and managing complex heterogeneously integrated 2.5D and 3D IC designs.
Nova introduced the Nova WMC, a next-generation modular optical metrology platform tailored for advanced packaging applications. The system reportedly offers versatility, supporting various wafer sizes and forms—including traditional and framed wafers—and multiple metrology technologies in a modular manner. This flexibility could enable semiconductor manufacturers to address the complex requirements of advanced packaging processes with a single, scalable solution.
Collaborations
Deca announced a collaboration with SST to develop a comprehensive non-volatile memory (NVM) chiplet package. The project merges Deca’s M-Series™ fan-out and Adaptive Patterning® technologies with SST’s SuperFlash® embedded flash, with the intention of delivering a scalable solution for advanced packaging and heterogeneous integration.
Fraunhofer IZM hosted the official kick-off meeting of the Glass Panel Technology Group on October 1, 2025, in Berlin. The initiative brings together 15 major companies from across the value chain—from material suppliers to system integrators—to advance the technological future of glass substrates. The group aims to foster partnerships for knowledge exchange, develop glass-based substrates on large panel formats, and promote advanced packaging with glass as a key material.
Finetech announced the official launch of its funded All-Nano Project, welcoming representatives from Fraunhofer IZM-ASSID and NanoWired to its Berlin headquarters for the kickoff meeting. The collaborative initiative aims to advance nanowire-based interconnection technologies for highly integrated, reliable, and cost-efficient semiconductor packaging. Its objectives include developing a cleanroom-compatible system based on 300 mm silicon wafers and integrating the technology into European semiconductor manufacturing for applications in autonomous driving, high-performance computing, and medical electronics.
PDF Solutions announced a collaboration with Lavorro to integrate its analytics platform with Lavorro’s generative AI-powered virtual assistants, aiming to enhance decision-making in semiconductor manufacturing. The partnership is designed to help fab operators access real-time process data and in-context engineering knowledge, supporting yield optimization and improved production outcomes.
Expansions and Development
EV Group announced the official opening of EV Group E. Thallner Singapore Pte. Ltd., with the intention of expanding its footprint in Asia and strengthening customer support in the region. The new subsidiary, located in Singapore will provide localized services including equipment lifecycle management, process development, and training. EVG also integrated the experienced team from Link Fab Technologies, enhancing its technical expertise and continuity in the region.
Kuehne+Nagel launched a new air-logistics gateway in Bengaluru, India, strengthening its global cargo network and support for high-growth sectors including semiconductors, high-tech, healthcare and automotive. The facility enables enhanced load efficiency, routing flexibility and real-time digital integration for customers across intercontinental trade lanes.
ASE announced the signing of a Memorandum of Understanding (MOU) with Analog Devices, Inc. (ADI) to acquire ADI’s manufacturing facility in Penang, Malaysia, marking a major step in expanding its global manufacturing footprint. Following the acquisition, the two companies plan to enter a long-term supply agreement and co-invest in enhancing the site’s technology and operations.
Amkor Technology broke ground on its new advanced packaging and test campus in Peoria, Arizona, marking a significant U.S. investment in semiconductor manufacturing and supply-chain resilience. The facility will include smart-factory technologies and scalable production lines to support high-performance computing, AI, mobile communications, and automotive applications.
SEMI reported that global equipment spending for 300 mm fabs is projected to total approximately US $374 billion from 2026 to 2028, with worldwide investment expected to exceed $100 billion in 2025. The growth is driven by AI-demand, regional manufacturing expansion, and next-generation process capacity build-out.
Veeco announced that an optical communications laser manufacturer has placed an order for multiple Lumina™ metal organic chemical vapor deposition (MOCVD) systems. These systems will be used for indium phosphide (InP) epitaxy on both 4-inch and 6-inch wafers, supporting the fabrication of InP lasers for innovative optical communication solutions in the datacom industry.
Yield Engineering Systems (YES) was selected by a major AI infrastructure supplier to deliver a comprehensive suite of advanced-packaging tools designed for panel-level production on glass substrates—targeting next-gen applications in high-performance computing and AI. The order spans YES’s portfolio including VertaCure™, VertaPrime™, VeroFlex™ FAR, TersOra™, and SURE™ systems.
Brewer Science officially opened the Brewer Science Arizona Innovation Center in Chandler, Arizona, expanding its U.S. footprint and reinforcing the region’s role as a growing semiconductor hub. The new facility is designed to strengthen research and development, support supply chain resilience, and accelerate innovation for future semiconductor technologies.
Evatec commemorated ten years of expansion across Asia, having grown from two regional offices in Singapore and Malaysia in 2016 to thirteen locations today. The company recognized the contributions of its Asia-based teams in strengthening customer support and advancing thin-film technology solutions across key markets.
MacDermid Alpha Electronics Solutions signed a definitive agreement to acquire Micromax–a high-performance inks and pastes company for multilayer circuits and harsh-environment electronics. This move strengthens MacDermid Alpha’s advanced packaging, multilayer circuitry, and high-reliability application. This deal is expected to close in Q1 2026.
Awards and Recognition
EV Group received the inaugural SEMI Americas Catalyst Award, honoring its President & Co-founder Erich Thallner for visionary leadership and decades of innovation in semiconductor equipment and MEMS manufacturing.
EV Group additionally received the 2025 Upper Austrian Innovation Award in the large enterprise category for its IR LayerRelease™ technology, a solution advancing microchip scaling and 3D integration.
ACM Research was recognized as the 2025 Innovator of the Year by the Portland Business Journal as part of its annual Makers & Manufacturers of the Year Awards. The honor highlights ACM’s continued contributions to advancing semiconductor manufacturing technology. CEO and President Dr. David Wang, Vice President of Sales Jim Straus, and General Manager Henan Zhang accepted the award earlier this month on behalf of the company.
SEMI recognized industry leaders for their significant contributions to standards advancing semiconductor manufacturing. Stefan Radloff of Intel, with over 28 years of involvement in the SEMI Standards Program, was honored for his leadership in the Film Frame FOUP Task Force and co-leadership in the Next Generation Assembly/Test Material Handling Japan Task Force. His extensive industry experience has been instrumental in spearheading the development of several standards in the SEMI Equipment Automation Software & Hardware (E) volume.
Koh Young earned the Service Excellence Award for the fourth time in five years, reflecting strong customer satisfaction across support, responsiveness, and quality service metrics.
Circuits Integrated was named a Start-Up of the Year finalist for the upcoming Elektra Awards, recognizing the company’s continued innovation toward achieving faster, downtime-free communications. Winners are set to be announced on December 9.
Yield Engineering Systems (YES) celebrated its 45th anniversary, marking nearly half a century of innovation in advanced packaging and surface modification technologies. The company reflected on its growth while looking ahead to its next chapter, emphasizing continued investment in new tools and processes to meet the evolving needs of the semiconductor industry.
TechSearch International received the Corporate Recognition Award at the IMAPS Symposium 2025 in San Diego, honoring the firm’s long-standing contributions to semiconductor packaging research. E. Jan Vardaman accepted the award on behalf of the team, recognizing the efforts of analysts and engineers worldwide who advance TechSearch’s mission to deliver timely, data-driven industry insights.
Indium Corporation received a Mexico Technology Award for its halide- and halogen-free flux-cored wire, CW-807RS, recognized for excellence in manual and robotic soldering applications. Accepted by Ivan Castellanos and Rogelio Torres Pérez at the SMTA Guadalajara Expo, the award highlights the product’s faster wetting performance, advanced spatter control, and high reliability for halogen-free assembly.
Industry Events
ASE participated in the Open Compute Project (OCP) Global Summit 2025, held at the San Jose McEnery Convention Center. The event drew more than 11,000 attendees and featured discussions centered on scaling AI data center infrastructure and advancing collaboration across the semiconductor value chain. ASE showcased its advanced packaging and chiplet integration technologies in the Innovation Village. During the conference, ASE’s Lihong Cao joined a panel on co-packaged optics, exploring its growing relevance for high-performance computing and AI data centers.
Onto Innovation hosted its 2025 Executive Supplier Conference in Santa Clara, themed “Redefining Resilience: Global Partnerships in a Changing World.” The event underscored the importance of collaboration across the supply chain, with Supplier Excellence Awards presented to various companies at the event for their achievements in innovation, quality, and partnership.
Koh Young will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025. Héctor Hernández, Regional Sales Manager for Koh Young America, will deliver a technical session titled “The Power of Data: Maximize Productivity with Smart Factory Insights.” The presentation will explore how manufacturers can harness data to improve productivity, traceability, and quality across the SMT line, utilizing AI-driven platforms like KSMART and KPO to automate programming and optimize processes.
Indium Corporation announced that its technical team will present at SMTA International 2025. The presentations cover topics such as low-temperature solder alloys and thermal interface materials optimized for advanced electronics manufacturing, underscoring the company’s commitment to materials innovation in assembly and reliability.
Indium Corporation also announced that Assistant Product Manager Foo Siang Hooi will present a technical session on “Advancing Thermal Performance: Next-Generation Pattern X Compressible Metal TIM” at TestConX China on November 13 in Shanghai. The session focuses on metal thermal interface materials designed for warped or non-planar surfaces in applications including high-performance computing, automotive electronics, and power semiconductors.
NHanced Semiconductors VP, Dr. Charles Woychik, delivered a presentation titled “The Future of Electronics Packaging Is Chiplet Architecture” at SMTA International 2025 in Rosemont, IL. The talk addressed hybrid bonding as a critical technology for die-to-wafer and wafer-to-wafer integration, including sub-10 µm pitch copper-to-copper interconnects, and explored system-level open standards such as UCIe.
Syenta’s Co-Founder and CEO, Jekaterina Viktorova, presented at SEMICON Australia, followed by an interactive Q&A panel alongside representatives from Innofocus and Morse Micro.
KLA President Dominic David participated in the IFQM Symposium in India, joining other industry leaders to discuss strategies for strengthening the nation’s semiconductor ecosystem through innovation, collaboration, and workforce development.
PDF Solutions highlighted its Optical Measurement Module (OMM) at a recent Detroit industry event, demonstrating how AI-driven, high-resolution imaging improves electrode quality control and manufacturing yield. Peter Kostka, Director of Battery Solutions, presented on the role of imaging and AI in achieving process stability during scale-up, while Nika Kafeety joined a panel discussion on EV charging infrastructure alongside individuals from Electrify America and Inspiration Mobility Group.
Workforce Development
Indium Corporation launched its 2026 Internship Program, featuring a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests. This flexible approach ensures that each intern can focus on projects and skill development that matter most to them while gaining hands-on experience in a collaborative, innovative environment.
SEMI Foundation introduced ChipPath, a new platform designed to connect talent with thousands of open semiconductor jobs across the U.S. The initiative is part of the National Network for Microelectronics Education (NNME), aimed at strengthening and expanding the domestic semiconductor workforce. The Foundation credited its team and partners for helping advance this key workforce development milestone.
Career Advancements and Opportunities
The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a call for papers on the theme “Advancing the AI Frontier through VLSI Innovation.” The five-day in-person event will be held at the Hilton Hawaiian Village in Honolulu, HI, from June 14–18, 2026. The Symposium seeks papers focusing on technical innovations in areas such as advanced CMOS platforms, advanced packaging, chiplet and heterogeneous integration technologies, and devices and accelerators for machine learning/deep learning and new compute technology. The paper submission site will open on December 2, 2025, with the deadline for submissions on January 26, 2026.
SEMI Foundation, in partnership with the National Science Foundation, opened a national Request for Proposals (RFP) inviting applications from regional consortia to serve as nodes for the National Network for Microelectronics Education (NNME). Selected nodes—up to eight in total—may receive funding up to $20 million over five years, supporting workforce development programs, hands-on training, and industry-aligned partnerships. The deadline for full proposals is December 22, 2025.
Amkor Technology is hiring for a Chief Accounting Officer position in Tempe, AZ. Interested? Learn more here.
Veeco is hiring for an Engineering Program Manager in Horsham, PA. Interested? Learn more here.
Syenta is hiring for various positions including:
Chief of Staff – Sydney, Australia.
Laboratory Manager – Sydney, Australia
Engineering Lead – Tempe, Arizona
