The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and international collaborations. Companies unveiled new process solutions, inspection systems, and AI-enabled design tools, emphasizing advancements in materials, memory, and compound semiconductor manufacturing.
Workforce development initiatives strengthened ties between academia and industry. Sustainability and global collaboration was at the forefront, from environmentally conscious innovations, to partnerships bridging Europe, Asia, and North America. September’s news illustrated the industry’s commitment to integrating cutting-edge technology with scalable manufacturing, international corporation, and long-term resilience.
Technology and Innovation
Siemens introduced Tessent™ IJTAG Pro, a new software designed to accelerate semiconductor design and testing. By enabling parallel operations for traditionally serial IEEE 1687 IJTAG processes, the tool allows high-bandwidth internal JTAG access and generic data streaming, reducing both test time and cost when paired with Siemens’ Tessent Streaming Scan Network.
Siemens also introduced Tessent AnalogTest, the first automated design-for-test solution for analog circuits. Working with Tessent DefectSim, the software intends to cut analog pattern-generation time from months to days and executes tests up to 100 times faster than manual methods. It automatically creates digital vectors and verifies defect coverage before tape-out, reducing cost and improving quality for IC makers.
ACM Research introduced the Ultra ECDP Electrochemical Deplating Tool, designed for gold etching in compound semiconductor applications. This tool enhances uniformity, reduces undercut, and improves gold line appearance during wafer-level processing. It supports various processes, including bump removal, thin film etching, and deep-hole deplating, and is compatible with 6-inch and 8-inch wafers. The system’s modular design allows integration of plating and deplating processes, addressing the unique challenges of wide bandgap semiconductor manufacturing.
The company also delivered its first high-throughput Ultra Lith™ KrF Track System to a logic wafer fab, marking a key milestone in its lithography portfolio. Designed for mature-node devices, the system delivers exceptional throughput, precision, and efficiency to meet next-generation production demands. CEO David Wang noted that adding KrF capability alongside ACM’s ArF track systems enables seamless fab integration and greater manufacturing flexibility across diverse applications.
Nordson Electronics Solutions announced full compatibility of its ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials. This integration offers electronics manufacturers a sustainable, energy-efficient production path without sacrificing performance. Actnano’s Advanced nanoGUARD™ coatings eliminate the need for energy-intensive curing ovens while maintaining protection for printed circuit board assemblies. The integration supports Nordson’s ASYMTEK Select Coat® SL-940 and SL-1040 platforms, enhancing throughput and reducing environmental impact.
SEMI unveiled its new Conductor™ Intelligence Platform at SEMICON Taiwan 2025. The platform aggregates real-time data and analytics across the global electronics value chain to provide interactive KPIs, AI-powered insights, and collaborative tools designed to boost supply chain resilience and visibility.
Collaborations
Siemens and Merck Group announced an expanded strategic partnership aimed at accelerating AI and data-driven drug discovery. The collaboration integrates the Siemens Xcelerator platform with Merck’s life-sciences portfolio to create end-to-end digital workflows intended to shorten development timelines and reduce costs in bringing new therapies to market.
The company joined the CHERI Alliance to advance hardware-level cybersecurity. By enabling memory-safe architectures through its Questa™ One Smart Verification solution, Siemens aims to help design teams reduce risk and accelerate secure innovation. The partnership brings CHERI’s 15 years of research into practical industry applications, intended to strengthen defenses against evolving memory-safety exploits.
Deca Technologies and Silicon Storage Technology (SST) announced a strategic collaboration to develop NVM (non-volatile memory) chiplet solutions. The partnership combines Deca’s fan-out and patterning capabilities with SST’s SuperFlash embedded flash technology to enable modular, multi-die chiplet integration across different chips, nodes, and foundries — streamlining design cycles and promoting heterogeneous architectures.
PDF Solutions secured a significant multi-year contract with a major global semiconductor manufacturer. The agreement involves deploying eProbe® tools, Characterization Vehicle® infrastructure, and Exensio® analytics software across multiple high-volume manufacturing facilities. This collaboration aims to enhance yield learning and variability control by integrating process characterization data with design and in-line fabrication data, supporting the industry’s shift towards AI-driven semiconductor manufacturing.
Brewer Science joined the JOINT3 Consortium, a collaborative platform launched by Resonac Corporation to accelerate development of panel-level organic interposers. The consortium unites materials, equipment, and design firms using a prototype 515×510 mm panel line to test optimized interposer materials and tools. Brewer emphasized its role in contributing its polymer materials expertise toward smarter, more sustainable packaging solutions.
Amkor Technology announced its role as a core ecosystem partner in the new Global AI + Semiconductor Startup Hub and Design Center launching in Phoenix, Arizona. In collaboration with TSMC, Cadence, TESORO VC, and the City of Phoenix, the initiative is intended to accelerate 40–60 deep-tech startups annually, provide an end-to-end pathway from chip design to high-volume manufacturing, and create hundreds of specialized engineering roles in Greater Phoenix. Amkor will contribute its advanced packaging and test capabilities to help emerging companies shorten development cycles and scale AI-driven semiconductor solutions, reinforcing U.S. leadership in next-generation chip technologies.
Expansions and Development
Brewer Science opened a new office and lab in Chandler, Arizona, named the Brewer Science Arizona Innovation Center. This expansion strengthens the company’s proximity to key customers, partners, and research collaborators, while providing direct access to the robust talent pool in the Greater Phoenix area. The center will serve as both a collaborative research space and a customer engagement hub, accelerating product development and shortening the feedback loop from lab to fab. All Brewer Science R&D and manufacturing operations are conducted in the United States, reinforcing the company’s commitment to domestic innovation and supply chain resilience.
Henkel opened its Inspiration Center for Adhesive Technologies in Shanghai, China. Spanning 33,000 m², the facility houses advanced laboratories and collaborative spaces where more than 500 scientists and experts will develop sustainable innovations for industries across the Asia-Pacific region. The center is designed to accelerate customer partnerships, transform local insights into scalable solutions, and strengthen Henkel’s innovation capabilities in the region.
Henkel also opened its Adhesive Technologies North America Battery Application Center in Madison Heights, MI. The facility expands Henkel’s global battery innovation network, providing advanced material application capabilities to accelerate EV component development and strengthen regional support for OEMs and battery manufacturers.
Koh Young held its inaugural technical review meeting at its new Taiwan office, demonstrating advanced metrology and inspection solutions to partners and local customers.
Awards and Recognition
Four of ASE’s engineers were honored in the SEMI 20 Under 40 Awards, recognizing emerging leaders shaping the semiconductor industry. Winners include Melvyn Chang (Innovation), Katrina Lee (Leadership), 昱敞陳 (Industry Contribution), and Wythe Hsu (Industry Contribution) for breakthroughs spanning SiP technology, AI-driven manufacturing, double-sided packaging, and automotive IC process standards.
Indium Corporation was honored with a Mexico Technology Award for its CW-807RS flux-cored wire. This halide- and halogen-free solder wire improves wetting speeds and cycle times in electronics assembly and robotic soldering applications. The CW-807RS is an upgraded version of the company’s CW-807 formula, featuring enhanced spatter control and clear residues, making it suitable for high-temperature soldering processes.
Brewer Science was named a 2025 Top Workplace, an honor based on anonymous employee feedback. The recognition reflects the company’s ongoing efforts to foster a positive and engaging workplace culture across its operations.
Syenta advanced to the finals of the SEMI S3 startup competition and will pitch its high-density interconnect technology live at SEMICON West in Phoenix on October 8.
Industry Events
LPKF Laser participated in European Microwave Week (EuMW) 2025 in Utrecht, highlighting PCB prototyping and high-frequency glass processing solutions. At Booth B150, team members Jan-Hendrik Guttmann and Lukas Illig discussed rapid prototyping options for complex multilayer RF designs, while Vitrion specialist Maik Bertke introduced innovative glass processing capabilities for high-frequency applications. In parallel, Stefan Kiel represented LPKF at the E&A trade fair with partner Tooltronics, ensuring broad customer engagement across multiple industry events.
PDF Solutions will participate in AWS SemiCon Day in Singapore on September 29. The event will bring together semiconductor leaders to examine how cloud computing and generative AI are transforming chip manufacturing. At its booth, the company will demonstrate data-driven solutions aimed at breaking down silos, improving process control, and supporting the development of next-generation smart fabs.
Additionally, PDF Solutions CEO, John Kibarian, delivered a keynote at the 2025 Advanced Process Control and Smart Manufacturing Conference on September 23. His presentation focused on the evolution of semiconductor collaboration, emphasizing the role of data-driven process control and smart manufacturing in improving yield, efficiency, and innovation across advanced nodes.
Indium Corporation President and CEO, Ross Berntson, delivered a keynote at the CEO Forum during electronica India and Productronica India 2025 in Bengaluru. His remarks highlighted how innovation, advanced materials, and global collaboration are key to helping India achieve its $500 billion electronics manufacturing goal.
Indium also showcased a full range of energy-efficient, high-reliability solder solutions at Productronica India 2025, featuring Durafuse® HR and LT alloys, Indalloy®303 low-temperature solder, Indium12.9HF halogen-free paste, CW-807RS flux-cored wire, and InFORMS® reinforced preforms—each designed for next-generation EV and advanced-electronics manufacturing.
Indium additionally showcased a suite of high-reliability solder solutions at the SMTA Guadalajara Expo, held September 17–18. Products on display included Durafuse HR, Durafuse LT, Indium12.9HF halogen-free paste, CW-807RS flux-cored wire, and CW-818 no-clean wire, each tailored for automotive, high-reliability, and fine-feature assemblies.
Koh Young partnered with Fuji and Kurtz ERSA to host a technical seminar at Fuji’s factory in Kunshan, China, with more than 35 participating automotive electronics firms. The event focused on smart manufacturing solutions tailored for EV and automotive electronics — highlighting Koh Young’s True 3D inspection systems, AI-powered process control through KSMART, and synchronized integration with Fuji’s printing/mounting and Kurtz’s soldering technologies.
Koh Young additionally showcased its Nova series inspection systems at Productronica India 2025, including the KY8030 Nova SPI and Zenith Nova True 3D AOI. The systems feature warp compensation and AI-driven vision, designed to enhance yield and accuracy in semiconductor production.
Mycronic spotlighted its high-speed assembly and die bonding solutions at CIOE 2025 in Shenzhen from Sept. 10–12. The company showcased the MRSI-LEAP die bonder, which supports precision, high-throughput optical module assembly using processes like epoxy bonding, UV curing, wafer-level packaging, and eutectic bonding — all tailored for AI-driven optical interconnects.
Yield Engineering Systems at SEMICON India 2025 showcased its VertaCure™, VeroTherm™, and SURE™ systems for advanced packaging. Over three days, attendees explored how these tools enhance next-generation packaging performance and reliability.
SEMI’s SEMICON Taiwan 2025 reinforced Taiwan’s key position in the global semiconductor supply chain. SEMI’s Clark Tseng reported that Taiwan’s semiconductor equipment investments are projected to reach $28B in 2025, a 70% year-on-year increase, with AI and high-performance computing expected to drive 40% of global equipment spending by 2025 and over 55% by 2030. Despite trade tensions, industry confidence remains high, with top cloud providers’ capital expenditures forecast to climb from $210B in 2024 to more than $310B in 2025, fueled by demand for AI infrastructure.
At SEMICON Taiwan 2025, MacDermid Alpha Electronics Solutions highlighted its latest materials for advanced packaging and power semiconductors at booth L1108. Featured technologies include fine-grain copper for hybrid bonding, IMC-free barriers for micro-pillar solder joints, NOVAFAB® fine-grain Cu, Low Alpha Tin, and the ATROX® Zero PFAS die-attach product line. The company’s senior R&D leaders also presented strategies to improve interconnect reliability in 3D integration.
Finetech showcased its FINEPLACER® pico 2 at the Electronics & Applications (E&A) 2025 tradeshow in Utrecht, held September 23–25. Demonstrated at the Tooltronics booth, the manual die bonder highlighted its 3 µm placement accuracy, fast setup, and modular system architecture — features aimed at R&D labs, universities, and small-batch production. The pico 2 supports 300mm wafers and multiple bonding methods, including soldering, adhesive, ultrasonic, and thermocompression, while Finetech’s IPM Command software streamlines process optimization and transfer to production tools.
Workforce Development
NHanced Semiconductors President, Robert Patti, presented at the INFIERI Summer School program, discussing advanced semiconductor architectures for future memory systems, AI, and HPC applications. The program offered students and industry professionals insights into emerging memory technologies and high-performance computing innovations.
ASE participated in the CAREhER Summer Summit 2025 in Kaohsiung, Taiwan, supporting an event focused on sustainability, leadership, and energy. Women leaders from across Asia-Pacific and Europe – including representatives from TSMC, Bechtel, and Micron – shared perspectives on carbon capture, water reuse, AI-driven supply chains, and smart manufacturing. Discussions highlighted both technological advances and personal leadership stories, reflecting ASE’s continued commitment to initiatives that connect and empower women leaders across industries and borders.
SEMI University announced support for a UC San Diego initiative funded by the National Science Foundation, aimed at equipping students with semiconductor skills and hands-on training. The collaboration is part of a broader effort to expand U.S. workforce development and strengthen the domestic talent pipeline.
Career Advancements and Opportunities
EV Group promoted Cindy (Yu-Ying) Lee to General Manager of EVG Taiwan Ltd., effective immediately. Lee succeeds Tsemin Tsai and previously served as Technology Development & IP Manager for nine years.
ACM Research is hiring in Hillsboro. At the Hillsboro, Oregon Career Expo this month, ACM featured job listings for field service engineers, facilities technicians, and an EHS manager. Learn more.
Veeco is hiring for a systems engineer position in St. Paul, Minnesota. Learn more.
