ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever...
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within...
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the...
While we wait in the 3D IC holding pattern for products to go into high volume, processes continue to be...
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
SEMICON West 2014 brought its usual flurry of supplier announcements on new equipment and process improvements; but there weren’t as...
Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related...
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind...
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater...
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news,...
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are...