Latest Posts
Finetech Demos Flip-chip Bonding at MIT Bootcamp for Integrated Photonics
On January 17, Finetech participated in the Massachusetts Institute of Technology’s (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience...
Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging
Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level...
Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
Continental Drifts or Tectonic Shifts? Advanced Packaging 2017
That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at...Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Convergence on the “Big Five”: Focus on WLCSP
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially,... Convergence on the “Big Five”: Focus on Low-cost Flip Chip
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and...
Mobile Sector Dominates the Advanced Packaging Market as IoT Looms on the Horizon
“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement...
Flip Chip Technology: Which Companies will Invest to Support Growth?
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help...Walker’s 2011 Forecast: After the 2010 Boom – Now What?
What the room heard: Get ready for a second downturn. DRAM is in the tank because PC production is down,...New era calls for new strategies
I’ve always been good at connecting the dots. I find it easier to understand a novel concept if I can...Prior Predictions
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in...Manish’s Market Moment
For me, SEMICON West is never complete until I’ve had my sit-down with Manish...