Latest Posts - Page 4
IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA)...NHanced Semiconductors Opens Leading-Edge Advanced Package Assembly Facility, Reinforcing Indiana’s Position as a Major Semiconductor Hub
U.S. Senator Todd Young (R-IN) and NHanced Semiconductors President Robert Patti, at the ribbon-cutting at the Odon facility, announce new...
IFTLE 581: The National Advanced Packaging Manufacturing Program
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America...
Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal
Partnership to strengthen the European automotive supply chain and expand services for global customers Amkor Technology, Inc. (Nasdaq: AMKR), a...
Will a New Advanced Packaging Foundry Model Extend Moore’s Law?
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that...
IFTLE 579: Workforce Development – SCALE
The Scalable Asymmetric Lifecycle Engagement (SCALE) program is the nation’s preeminent workforce development effort, funded by the Department of Defense’s...
SEMICON Europa 3D InCites Member Spotlight: What We’re Doing to Shape a Sustainable $1 Trillion Era
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in...
IFTLE 577: Amkor Announces US Packaging Facility; IBAS RESHAPE Winners Announced
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
Flux-less TCB for Fine-Pitch Applications and Its Extension to Cu-Cu TCB
Modern-day applications such as cloud computing, high-performance computing, artificial intelligence (AI), data centers, and future 6G systems are driving the...
IFTLE 575: Intel’s Interest in Glass Core Substrates
Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade....
IFTLE 573: CHIPS Act Microelectronics Commons Regional Innovation Hub Winners
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization...
IFTLE 572: North American Advanced Packaging, New Materials, and New Leaders
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we...
How is X-ray Inspection Used in Semiconductor Manufacturing?
Technology is Key With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures...
Finetech Announces FINEPLACER® pico 2 Purchase by AmTECH Microelectronics
Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
IFTLE 569: IMAPS CHIPcon – Samsung’s Advanced Packaging
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous...
IFTLE 568: Government Agency Roles in Onshoring Microelectronics
In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring...
Henkel Highlights Portfolio of Enabling Materials for Next-gen Semiconductor Devices at SEMICON Taiwan 2023
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers...
