Latest Posts - Page 6
IFTLE 549: Penn State CHIMES In
As IFTLE has been reporting for the past few months, monies continue to be poured into the onshore advanced packaging...
IFTLE 548: TSMC’s Off-Shore Production; STEAM PIPE
TSMC Off-shore Production Digitimes reports that when it comes to the production capacity of 28nm and below, TSMC has stated...
IFTLE 547: IBAS RESHAPE is Onshoring Advanced Microelectronic Packaging
In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS)....
IFTLE 546: AMAT buys into Absolics; Samsung’s AP Team; Update on the CHIPS program under NIST
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing...
IFTLE 544: IPC Advanced Packaging Symposium Part 3: Intel, IBM and AMD
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held...
IIFTLE 542: What We Need to Know about the US IC Substrate Infrastructure
The IPC Advanced Packaging Symposium: “Building the IC Substrate and Package Assembly Ecosystem” was held in Washington, DC in October....
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
IFTLE 541: Predicted Locations for CHIPS Innovation Hubs; Skywater/BRIDG IBAS Funding
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation...
SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
New Advanced Packaging Facility Coming To Indiana
Nov 21, 2022, saw the groundbreaking for WestGate One, a semiconductor campus that will house the first fab in the...
Book Review: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser,...
IFTLE 540: IMAPS Symp 2022: Nano-porous Copper; Adaptive Formed Glass
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
IFTLE 539: IMAPS On-Shore Packaging & Assembly Workshop; TSMC 3DFabric Alliance
As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall...
The Semiconductor Market Roller Coaster Ride is Back
Pat Gelsinger attended the WSJ Tech event in late October and as always had some interesting things to say about...
IFTLE 537: 2022 IMAPS Society Awards Go to Advanced Packaging Superstars
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
Amkor Leverages Its Global Automotive Leadership to Support European Semiconductor Ecosystem
TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test...
IFTLE 536: Government-sponsored Advanced Packaging Programs Taking Shape
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
