July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design and manufacturing technologies.
Companies expanded their global footprints, with major funding rounds and facility developments supporting next-generation packaging and system integration. Partnerships between industry leaders and academic institutions emphasized the growing need for specialized workforce development, while updates to Electronic Design Automation (EDA) tools and inspection systems showcased the sector’s rapid embrace of automation and digital transformation. A strong presence at international conferences and renewed regional initiatives further reflected the industry’s focus on innovation, sustainability, and global collaboration.
Technology and Innovation
Siemens introduced the latest updates to its NX and NX X solutions, part of the Designcenter suite for product engineering. The new features include AI-powered capabilities like Design Copilot NX, integrated thermal and fluid simulation tools based on Simcenter, and expanded model-based design methods for metrology and inspection. Siemens also announced new immersive collaboration tools developed in partnership with Sony. According to Frost & Sullivan’s 2025 MCAD industry analysis, Siemens’ NX software was recognized for its continued advancements in mechanical computer-aided design.
Kuehne+Nagel partnered with Natilus to introduce blended-wing body (BWB) aircraft to the commercial air freight sector. The BWB design offers a reported 60% increase in cargo volume and a 40% reduction in carbon emissions compared to traditional aircraft. This collaboration marks a step forward in sustainable logistics, with Kuehne+Nagel aiming to enhance capacity and efficiency for semiconductor and electronics supply chains worldwide.
ACM Research introduced key enhancements to its Ultra C wb wet bench cleaning tool, now featuring proprietary nitrogen (N₂) bubbling technology. This upgrade is designed to improve wet etch uniformity and overall cleaning performance, addressing the demands of advanced chip manufacturing. According to CEO Dr. David Wang, the tool continues to offer the benefits of batch processing—including efficiency, lower chemical use, and cost-effectiveness—while boosting results through this latest innovation. The upgraded system maintains batch processing benefits—including cost-efficiency and reduced chemical usage—while targeting improved yields at advanced nodes.
Yield Engineering Systems announced the delivery of multiple VertaCure™ LX curing systems to support advanced semiconductor device manufacturing. Designed for low-temperature processing, the VertaCure LX reportedly enhances film performance, including UV-cured materials, and can be configured for high-volume production across multiple wafer sizes. The shipments highlight ongoing demand for high-efficiency curing technologies in heterogeneous integration and advanced packaging applications.
Multibeam Corporation secured $31 million in Series B funding to accelerate the deployment of its multi-column electron beam lithography (MEBL) systems. The investment will support development of next-generation maskless lithography platforms for 300mm wafers and panels, targeting applications in quantum computing, photonics, MEMS, and power devices. The funding round was led by Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital. Multibeam aims to complement optical lithography by addressing growing demands in advanced packaging and semiconductor integration.
Collaborations and Acquisitions
Nordson Test & Inspection expanded its strategic partnership with distributor smartTec Nordic A/S to support growth in Denmark, Sweden, Finland, and Norway. The collaboration is intended to provide enhanced regional access to Nordson’s test and inspection systems, including X-ray and automated optical inspection (AOI) solutions, with a focus on improving responsiveness and customer support in the Nordic electronics manufacturing market.
Onto Innovation announced it has entered into a definitive agreement to acquire the materials analysis business of Semilab International for approximately $545 million in cash and stock. The acquisition adds four product lines centered on inline wafer contamination monitoring and materials interface characterization—capabilities increasingly critical for advanced nodes, packaging, and compound semiconductor applications. The acquired business is projected to contribute roughly $130 million in annual revenue and is expected to be accretive to gross and operating margins within the first year. Onto Innovation plans to integrate its Ai Diffract™ modeling engine and leverage its metrology technologies to support customer yield learning and process development.
LQDX announced it completed divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K. a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors. The company previously divested its aluminum soldering business, MinaTM to Taiyo America Inc. CEO Simon McElrea says the company will now focus on its Glass-Core IC-Substrate technology (low-temp, low-cost TGV metallization) with partners in Silicon Valley and Europe, and have moved to a new facility in Mountain View.
PDF Solutions partnered with Intel with the intention of enhancing semiconductor manufacturing by integrating design data directly into the production workflow. This collaboration leverages e-beam inspection and AI-driven analytics to improve data characterization and yield optimization, particularly at advanced nodes. The joint approach emphasizes early engagement and R&D co-optimization, contributing to improvements in power management, thermal performance, and test processes for Intel’s 18A and 14A technologies featuring backside power delivery.
Fraunhofer IZM recently welcomed Eric Fribourg-Blanc, Senior Program Officer at the Chips Joint Undertaking, along with Dirk Schumann and Johannes Rittner from the Research Fab Microelectronics Germany (FMD). The visit centered on the APECS pilot line and its role in advancing European microelectronics. Discussions addressed strategic planning, institutional collaboration, and challenges in semiconductor research and production. The meeting aimed to identify synergies to strengthen Europe’s chiplet innovation ecosystem.
Kiterocket announced its acquisition by Southwest Strategies Group, a San Diego-based communications firm with more than 25 years of experience supporting large-scale infrastructure projects. While Kiterocket will continue to operate under its existing brand and maintain its focus on semiconductors, emerging tech, renewable energy, and future of food, the acquisition is intended to broaden its geographic reach and expand its service offerings.
The company additionally shared insights into its partnership with SEMI in a Silicon Semiconductor interview featuring Amy Smith. The collaboration aims to support SEMI’s initiatives across public policy, workforce development, supply chain, and other key areas by leveraging Kiterocket’s expertise in communicating complex technology value. The interview also highlights SEMI’s growing importance in the global semiconductor landscape and discusses expectations for SEMICON West 2025 in Phoenix.
SurplusGLOBAL hosted representatives from the Embassy of India in Seoul, the Korea Semiconductor Industry Association (KSIA), and the Korea Institute for Advancement of Technology (KIAT). The visit included discussions on potential collaboration and partnership opportunities within the semiconductor industry. The meeting aimed to strengthen existing ties and explore avenues for future cooperation, signaling ongoing commitment to fostering international relationships in the sector.
Trymax hosted representatives from ChipNL Competence Centre and the Austrian Silicon Alps Cluster at its facility. The visit included a presentation on Trymax’s corporate story, a guided tour of the lab and production floor gowning area, and discussions focused on fostering international collaboration within the semiconductor industry.
Expansion and Development
EV Group expanded its on-site kindergarten at headquarters in Austria, tripling its capacity to better support working parents within the company. This expansion makes it easier for team members to focus on innovation while ensuring their families are cared for close by.
Amkor Technology announced a $2 billion investment to build a new semiconductor packaging and test facility in Peoria, Arizona. The project is expected to create over 2,000 jobs and bolster the U.S. semiconductor supply chain. The facility incorporates advanced environmental measures, including HEPA filtration systems that provide air purity cleaner than hospital operating rooms, scrubber and thermal oxidation systems removing over 99% of emissions, and a verified net-zero emissions commitment targeting 2050. Built-in smart systems will ensure continuous monitoring and control to maintain air quality well below regulatory standards.
SurplusGLOBAL announced that Cluster B, home to the upcoming SemiMarket Offline Parts Mall, is slated for completion by July 2026. This global hub is designed to bring together buyers and sellers of legacy semiconductor equipment and parts in a physical setting. Positioned as a new kind of offline platform, the Parts Mall will foster industry connections, extend the lifecycle of critical tools, and create a space for professionals to exchange ideas and innovation.
SEMI and TechSearch International released the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database. The new edition expands to tracking approximately 750 global ASM & test facilities—70 more than in 2024—and includes enhanced data such as unique facility IDs and device-type details (e.g. memory, RF, CMOS image sensors) to support planning and market analysis.
MacDermid Alpha Electronics Solutions launched macdermidalpha.com – a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Awards and Recognition
Finetech is celebrating a major leadership milestone as CEO Carlotta Baumann is named one of Berlin’s “Top 40 under 40” in business by Verlag Der Tagesspiegel. This latest recognition follows her 2024 EY Entrepreneur of the Year award in Innovation. Baumann is recognized for combining systems-level thinking with a people-first approach, reflecting Finetech’s broader transformation into a full-cycle technology partner. Reflecting on the event, Baumann emphasized the value of local collaboration and the importance of accelerating innovation to remain globally competitive.
Evatec AG has a distinctive and fun way of honoring long-serving employees with a special farewell gift: a golden wafer featuring the employee’s picture. The wafer is produced using titanium as an adhesion layer and gold as a decorative surface. The multi-step process, which takes about two hours, involves coating, varnishing, exposure, development, and etching to achieve the detailed 3D image of the employee’s face. This personalized golden wafer symbolizes appreciation and serves as a lasting memento of the time spent at Evatec.
Adeia was named one of U.S. News & World Report’s Best Companies to Work For in 2025–2026, marking its second consecutive year on the list. The company earned distinctions in three categories: Best Companies Overall, Best in the West, and Best in Media & Communications. The rankings evaluated nearly 5,000 employers based on pay, work-life balance, stability, and employee well-being.
Industry Events
Micross is set to participate in the Small Satellite Conference from August 11–13, 2025, in Salt Lake City. The event gathers over 4,000 professionals from industry, government, and academia to discuss innovations in small satellite missions. Micross will showcase its latest products and services, including DC-DC power supplies, RF and microwave solutions, STT-MRAM, PEM up-screening, and testing and qualification services at Booth #332.
SEMI and the India Semiconductor Mission (ISM) announced the opening of visitor registration for SEMICON India 2025, to be held September 11–13 at Yashobhoomi (IICC) in New Delhi. With the theme “Building the Next Semiconductor Powerhouse,” the event will feature keynotes, technical forums, and a new Workforce Development Pavilion. The conference aims to support India’s aspirations to become a global semiconductor hub through knowledge exchange and cross-border collaboration.
SEMI also announced that SEMICON Taiwan 2025 will take place September 3–5 at Taipei Nangang Exhibition Center. This year’s event is expected to attract over 950 exhibitors across more than 3,000 booths, with forums and pavilions spotlighting advanced packaging, heterogeneous integration, AI, and green manufacturing. The summit is positioned to facilitate cross-border collaboration and showcase Taiwan’s continued leadership in semiconductor innovation.
On top of that, SEMI highlighted a key moment from the 2025 SEMI 3D & Systems Summit, where Isabella Drolz, Vice President of Marketing & Product Strategy at Comet, addressed how heterogeneous integration is playing a critical role in strengthening Europe’s semiconductor resilience. Drolz emphasized the benefits of multi-vendor sourcing strategies and the potential for customized, secure system-level design—positioning integration as a cornerstone for Europe’s long-term supply chain and technological sovereignty.
NAMICS participated in CHIPCON 2025, held July 8–9 in San Jose, California. The company presented its latest advanced materials solutions tailored for semiconductor applications, including innovations in packaging, reliability, and material performance. Representatives, including Jack Melton, engaged with attendees to discuss emerging technologies aimed at enhancing semiconductor manufacturing and electronics packaging.
Circuits Integrated took part in the Greek Space Tech Forum, held in Greece. The company joined other innovators, entrepreneurs, and government leaders in discussions aimed at advancing Greece’s role in the global space technology sector. The event highlighted growing momentum within the Greek space ecosystem, emphasizing collaboration and innovation. As a Greece-based company, Circuits Integrated acknowledged its role in supporting the development of local technologies with global impact.
Workforce Development
IMAPS officially relaunched its Silicon Valley Chapter, with new leadership aiming to strengthen collaboration within the advanced packaging sector. The chapter will provide a platform for technical exchange, workforce development, mentorship, academic and start-up engagement, site visits, and networking events. Positioned in the heart of the semiconductor industry’s innovation hub, the chapter seeks to build a vibrant and inclusive packaging community that connects industry professionals, researchers, and emerging talent.
SEMI University has announced a strategic partnership with Arizona State University to broaden access to flexible, industry-aligned semiconductor education. The collaboration will debut a new suite of on-demand training courses, including AI Foundations: Prompt Engineering, Scripting ChatGPT with Python, Semiconductor Packaging Design and Manufacturing, and Characterization Techniques and Applications, along with a Lean Six Sigma Yellow Belt Certification. The initiative combines academic and industry expertise to deliver scalable training designed to prepare the next generation of semiconductor professionals.
Career Advancements and Opportunities
EV Group announced an internal leadership update, as Martin Schlosser transitions into the role of Regional Sales Manager. After serving as Key Account Manager, Schlosser will now take on a more sales-focused position, aiming to expand EVG’s regional presence and drive continued growth
Kuehne+Nagel appointed Shirley Sharma Paterson as Global Head of Sales for the semiconductor and electronics sector. Paterson brings more than 20 years of international experience in logistics, with a specialization in high-tech supply chains. Her appointment is intended to support Kuehne+Nagel’s semiconductor strategy, which focuses on end-to-end supply chain visibility, risk mitigation, and scalability across global markets.
Koh Young appointed Tom Hattori as President of Koh Young Japan. Hattori brings leadership experience in the electronics industry, having held roles at companies such as Nidec and GE. His appointment is intended to strengthen Koh Young’s regional presence and reinforce its focus on customer engagement and innovation in Japan’s advanced manufacturing sector.
Amkor Technology is hiring for a Talent Acquisition Director in Tempe, Arizona and Peoria, Arizona. Interested? Learn more here.
Amkor is additionally hiring in Vietnam for various positions including: SMT engineer, NPI/project management, Shift leader, Industrial engineer, IT information security engineer, IT network engineer, and IT server/storage engineer. Interest? Send your CV to ATV.Recruiting@amkor.com to apply.
ERS is hiring for various positions including Manager Final Test, Intern in service & repair, Logistics manager, Employee in Work Preparation, Production Planner, Field Application Engineer – Advanced Packaging Equipment, Production Manager, and Strategic/Technical Buyer. Interested? Apply here.
Trymax is hiring for a Process Intern, Monteur Hightech Machinebouq, Quality Intern, Mechanical Design Engineer, Financial Controller, and various Internships. Interested? Learn more here.
