R&D and Collaboration

Combining Technology Platforms and Integrating Complex Materials for New Applications

Combining Technology Platforms and Integrating Complex Materials for New Applications

Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven by specific customer needs and hence extremely difficult to anticipate. For some applications, we need to build, on top of CMOS, various sensors, filters, fluidic channels or photonics circuits. For certain other applications, we sometimes even use exotic sub... »

Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration

Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration

Multi-project wafer (MPW) programs have long been considered an economical way to integrate different IC designs from various teams to produce IC design prototypes and low volumes. Because IC fabrication costs are extremely high, it makes sense to share mask and wafer resources in this way. MPWs were historically used for 2D designs, but in 2009, Tezzaron Semiconductor launched an MPW for DARPA to... »

3D InCites Interview: RTI in 3D

3D InCites Interview: RTI in 3D

While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for mass markets such as mobile devices and consumer electronics, one US-based research institute has followed a different path more similar to that of the European research centers; focusing its 3D efforts beyond the mainstream to develop technologies for specialty application... »

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined up next to each other in the exhibit hall, but then again maybe it was just Interconnectology in action. News linking Tezzaron/Novati with both Ziptronix and Invensas indicates progress for all three companies in the 3D IC space, and leaves open the question of how lo... »

Courtesy of Governor Cuomo's press office

Nano Utica gets $1.5B Infusion; Probably Good Die Revisited; Developments in Monolithic 3D

Word on the street is, New York will soon be known as Nano York, with all the money the state is pouring into nanotechnology research and development. The most recent announcement by Governor Cuomo is a $1.5 Billion Public-Private investment intended to turn the Mohawk Valley (Utica) into the next major hub for nanotechnology research. A consortium of global technology companies headquartered at t... »

Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium

Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium

I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC event was “The Semiconductor Roadmap Symposium, A Collaborative Update From Standards Bodies, Industry Groups and the Entire Supply Chain”, it could have been “3D TSVs Roadmap Symposium…” based on the direction the panel discussions took throughout the day. Not that I’m complainin... »

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG, threw down the gauntlet, announcing it is investing more than €25M ($33M) to add manufacturing capacity for 3D ICs in its fab located near Graz, Austria. Analog 3D ICs featuring through silicon vias (TSVs) are already a reality at ams. The company introduced its first 3D IC int... »

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in 3D IC assembly materials. I’d previously interviewed Ho’s colleague,... »

Copyright: Nino Halm (Photographer)

Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows

A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed image of a 2.5D multi-project interposer wafer. I’ve been saving it for the next time I interviewed him. So it was the first thing I asked him about when I met up with him at the Silicon Saxony booth at SEMICON West. It’s a second-generation 2.5D passive interposer ... »

EV Group: Never a Dull Moment

EV Group: Never a Dull Moment

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with EV Group execs to talk about the company’s latest achievements and contributions to the 3D IC cause has become an annual SEMICON West tradition. In fact, I’ve probably spent more time with this team than any other in the 3D space because I’ve visited the headquarters in Schaer... »

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