Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US, Europe and Asia, has been pioneering ultra-miniaturized electronics by Embedded MEMS, Actives and Passives (EMAP) Technology with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digital, RF, analog, MEMS and sensor functions. GT-PRC has demonstrated groundbreaking technologies that include ultra-thin organic substrates, fine-pitch Cu-to-Cu interconnections, low temperature bonding with high assembly throughput and prototype functional module demonstration of digital Si and RF GaAs die embedding.

GT-PRC proposes the next consortium, building upon the above advances, 3D ThinPack with a focus on:

  1. 3D package stacking beyond conventional PoP leading to ultra-thin stacked modules
  2. Ultra-fine pitch and low profile package-to-package interconnections
  3. Novel thermal solutions for embedded thin die eliminating TIM
  4. 15µm pitch die-to-package Cu-Cu I/Os with high current carrying capability
  5. Ultra-slim substrates with low warpage
  6. Embedded thin IPDs

The primary objective of the proposed 3D ThinPack consortium is to achieve ultra-miniaturized heterogeneous sub-systems by 3D integration of multiple ultra-slim packages with embedded thin active or passive components. The two-year goal is to demonstrate a four-package stack within ~1mm thickness by advancing the above five technologies shown in Fig 1.

image004_0Fig 1: Proposed technologies for ultra-miniaturized 3D stacked modules

The proposed 3D ThinPack research addresses the need for highly-miniaturized and highly-functional heterogeneous modules with particular focus on:

  1. High-yield, low-cost, chip-last embedding with FR4-compatible manufacturing-processes
  2. Interconnections and assembly processes compatible with existing infrastructure

Companies interested in this new industry consortium are encouraged to contact Mr. Nitesh Kumbhat at or Prof. Rao Tummala at

Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…

View Francoise's posts

Become a Member

Media Kit