Latest Posts
A Look Inside The 3D Technology Toolbox For STCO
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling...
How 3D Keeps the Semiconductor Industry Scaling
Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the...
Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award
MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec,... imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices
LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and...
New Solution for Testing Chips Prior to 3D Stacking
Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful...
3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is...
Mission Impossible? Not for SEMI!
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
Announcing the Winners of the 2017 3D InCites Awards!
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
Finding The Next Switch for Semiconductor Scaling
The data traffic explosion, fueled by the Internet of Things (IoT), social media and server applications, has created a need...
ECTC 2016: Is the Life after Moore’s Law?
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic...
Combining Technology Platforms and Integrating Complex Materials for New Applications
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven...
Developing 3D Systems with Ultrafine and Dense Interconnections
For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further...
Taking 3D Integration to the Next Level
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
The IoT at SEMICON West 2015: We Just Can’t Get Enough
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
Comparing Two Flavors of Chip Stacking Yield
One of the ways to build more complex, powerful, and cost-effective electronic systems is stacking chips on top of each...
Cascade Microtech: In the imec 3D Test Lab
My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of...
Cascade Microtech Breaks Through the Barriers of 3D Test
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
