Altera joins imec’s advanced CMOS scaling program for 3-D process technology developmentMay 26, 2011 · By Francoise von Trapp · 3D In-Depth Imec has entered into a three-year research collaboration with Altera Corporation to develop advanced CMOS scaling technologies. Altera joins a...
Imec and Atrenta Develop Exploration Flows for 3D ICsMay 24, 2011 · By Francoise von Trapp · 3D In-Depth Atrenta Inc., provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration...
What’s in Store for 3D Fans at IWLPC 2010Nov 10, 2010 · By Francoise von Trapp · Blogs I was so busy making sure I have all the bios and presentations for the 3D sessions I’m chairing at...
Lowering integration risks for 3D TSV productsAug 25, 2010 · By Francoise von Trapp · 3D In-Depth A critical challenge for fabricating 3D products is the integration of the dies with through-silicon vias (TSVs) into functioning and...
Happy Birthday, IMEC!Feb 03, 2009 · By Francoise von Trapp · Blogs I finally realized why I find the semiconductor industry so compelling, and why the people are so great to work...
Even the Magic 8 Ball couldn’t have called itJan 18, 2009 · By Francoise von Trapp · Blogs In my last editorial as managing editor of Advanced Packaging magazine, I suggested we should turn to the Magic...
