IMEC

A Look Inside The  3D Technology Toolbox For STCO

A Look Inside The 3D Technology Toolbox For STCO

System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. Eric Beyne, imec fellow and program director of imec’s 3D system integration program and Julien Ryckaert, program director 3D hybrid scaling at imec, unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: lo... »

How 3D Keeps the Semiconductor Industry Scaling

How 3D Keeps the Semiconductor Industry Scaling

Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the next generation of semiconductor devices and keep the industry moving forward to achieve 3nm integrated circuits (ICs). More importantly, however, they discussed how to use 3D in both packaging and transistor cell design to achieve system integration that will enable integr... »

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California. Van d... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading global high-performance analog technology company, today announced they have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices. With two initi... »

New Solution for Testing Chips Prior to 3D Stacking

New Solution for Testing Chips Prior to 3D Stacking

Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful systems. Until now, it was impossible to probe the large arrays of fine-pitch micro-bumps on advanced chips before stacking. This had a negative effect on the compound yield (because of including faulty dies in the stack). Imec, together with FormFactor (formerly Cascade Microtech), has... »

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows a significant reduction of a system’s footprint and enables ever shorter an... »

Mission Impossible? Not for SEMI!

Mission Impossible? Not for SEMI!

San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at this picture of the South Hall you may ask yourself: “Can anybody organize a large trade show here and make it a big success?” My answer is: “YES, the SEMI team can! They did exactly this in July for SEMICON West 2017!” With some very creative spac... »

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote their participation in this year’s event. As heterogeneous integration, fueled by advanced packaging and 3D integration, mov... »

Finding The Next Switch for Semiconductor Scaling

Finding The Next Switch for Semiconductor Scaling

The data traffic explosion, fueled by the Internet of Things (IoT), social media and server applications, has created a need for ever-advancing semiconductor technologies. Servers, mobile devices, IoT devices… they drive the requirements for semiconductors’ future processing and storage capacity. But will we be able to continue traditional semiconductor scaling, as initiated by Gordon Moor... »

ECTC 2016: Is the Life after Moore’s Law?

ECTC 2016: Is the Life after Moore’s Law?

Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading microelectronics research institutes to discuss Life after Moore’s Law. Panelists included Marie-Noelle Semeria, CEA-Leti; Dim Lee Kwong, IME; Luc van den hove, imec; CP Wong, NCAP; and Subu Iye... »

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