Latest Posts - Page 3
IFTLE 457: Hybrid Bonding Comes of Age
I first started covering Ziptronix and its hybrid bonding technology back in 2007 when I was writing Perspectives from the...
Social Distancing Spotlight: A DBI Ultra Update
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
IFTLE 445: Hybrid Bonding at Xperi, GLOBALFOUNDRIES and Besi
The expansion of hybrid bonding as a process for high-density packaging was the topic of some presentations presented at the...
Novel Multi-die Integration Concept Offers Big Benefits
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder...
Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging
The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10. Two...
IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue
Continuing our look at the 2019 SEMI 3D and Systems summit in Dresden, we look at presentations on advanced packaging...
Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies
SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading...
Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate...
Hybrid Bonding: From Concept to Commercialization
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather...
Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
2017 European 3D Summit: Making Advanced Packaging Great Again
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced...
Outlook 2017: Advanced Packaging Technology Takes Center Stage
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments...
With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
Tessera to Acquire Ziptronix, Inc. for $39 Million
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash.... Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications
RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology...
Market Outlook for Permanent Wafer Bonding
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized...
