The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments...
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology...
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized...
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS,...