SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and DBI®) 3D semiconductor technologies. Together, Xperi and UMC will further optimize ... »
The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration at the system level. The session was chaired by Florian Herrault, HRL Laboratories, and featured Jeff Demmin, DARPA; Stefan Behler, Besi; Matthew Meitl, X-celeprint; Doris Tang, PlayNitride; and Val Marinov, Uniquarta. Presentations offe... »
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking with or without through silicon vias (TSVs), as well as MEMS and III-V applications. In this exclusive interview with Gill Fountain, Xperi, winner of the 2018 3D InCites Engineer of the Year award f... »
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on the market In 2017 we saw 3D chip technology start to appear in a range of different commercial ... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm. The copper/oxide... »
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow to evolve, the 3D integration conversation hasn’t changed too much over the pas... »
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing of images. As this image sensor technology enables an entirely ... »
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas, in 2011, which focused first on what they called “bridge technologies” that leverage existing packaging technologies to meet higher density requirements while waiting for full implementation of 3D ICs. In parallel, the Invensas team worked to optimize interposer and ... »
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry customers. Ziptronix’s patented ZiBond... »
RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix’s hybrid bonding patents for high volume applications. R... »
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