hybrid bonding

With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge

With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge

Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas, in 2011, which focused first on what they called “bridge technologies” that leverage existing packaging technologies to meet higher density requirements while waiting for full implementation of 3D ICs. In parallel, the Invensas team worked to optimize interposer and ... »

Tessera to Acquire Ziptronix, Inc. for $39 Million

Tessera to Acquire Ziptronix, Inc. for $39 Million

SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry customers. Ziptronix’s patented ZiBond... »

Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix’s hybrid bonding patents for high volume applications. R... »

Market Outlook for Permanent Wafer Bonding

Market Outlook for Permanent Wafer Bonding

Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are the main applications us... »

Triple I Prevails at EV Group

Triple I Prevails at EV Group

Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which has experienced consistent growth. While I was sufficiently ... »

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