Latest Posts - Page 2
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-on-a-Chip
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group...
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density...
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla....
Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement
Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...
Xperi and Micron Enter Into License Agreement for Hybrid Bonding
Xperi’s IP Licensing Business Deepens its Presence in Memory Market SAN JOSE, Calif.–(BUSINESS WIRE)–Adeia, the newly launched brand for the...
Another Strong Year Ahead for Hybrid Bonding Thanks to Heterogeneous Integration
While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable...
IFTLE 508: IEEE 3DIC: Hybrid bonding for GaN on Silicon HI; Intel discusses chiplets
The IEEE 3DIC Conference was held at North Carolina State University in Raleigh NC in person from Nov 15-18 2021....
IFTLE 504: YMTC Implements Hybrid Bonding for 128-Layer 3D NAND
Xperi Licenses Hybrid Bonding Technology to YMTC (Yangtze Memory Technologies Co) In October, Xperi announced it had licensed its hybrid...
Xperi Licenses Hybrid Bonding Technology to Yangtze Memory Technologies Co., Ltd. (YMTC)
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...
IFTLE 489: AMAT Addresses Hybrid Bonding; DECA M-Series Continues to Develop
Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied...
Hybrid Bonding Bridges the Technology Gap
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and...
The People Who Make DBI Possible
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular,...
IFTLE 478: Chiplet Nomenclature; EV Group/ASM Support D2W Hybrid Bonding
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and...
IFTLE 475: EPTC 2020: IME on Hybrid Bonding Challenges; Latest on Intel
IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter...
A Glimpse of IEDM 2020
The IEDM conference always has a great display of leading-edge technology in the papers, but I always find a great...
IFTLE 470: More on TSMC’s SoIC Hybrid Bonding and Intel’s Woes
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop...
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution to Speed Up Deployment of 3D Heterogeneous Integration
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end...
3D Packaging Breakthroughs, The GSA Awards, and How the Election Impacts the Microelectronics Industry
See that title? That was only part of how I spent last Thursday (December 3). My morning started with the...
