heterogeneous integration

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in R... »

Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference

Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference

Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the Global Business Council session, speakers portrayed heterogenous integration (HI)... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

Heterogeneous Integration Calls for Increased Materials Reliability

Heterogeneous Integration Calls for Increased Materials Reliability

Automotive reliability is a pivotal concern for heterogeneous integration technologies, especially as emerging mission profiles for electric and autonomous vehicles push component lifetimes out by two to three times or more over standard testing regimes. There has been an increasing realization of the importance of chip-package interaction (CPI) as a source of reliability issues in semiconductor a... »

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D” has been a topic of debate in the advanced packaging world ever since it was first added to the industry... »

3D InCites Top Picks for SEMICON West 2018

3D InCites Top Picks for SEMICON West 2018

Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the time to read this – it’s almost curtain time. Everything that needs to be prepped is done, and if it’s not, it’s too bad, because the show will go on! It seems like every year, there’s more and more content to choose from. And you must choose because it’s pretty much... »

The Heterogeneous Integration Roadmap Explained by Bill Chen

The Heterogeneous Integration Roadmap Explained by Bill Chen

Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled alongside major conferences around the globe so that as many people as possible can participate. We’ve been following the progress since the beginning. I caught up with Bill Chen, president of the IE... »

ECTC 2018 Paves the Path to Heterogeneous Integration

ECTC 2018 Paves the Path to Heterogeneous Integration

For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can achieve with innovations in 3D, advanced packaging, and other heterogeneous integration (HI) technologies. Based on the turnout at this year’s IEEE Electronics Components and Technologies Conference, which took place May 29-June 1 in San Diego, CA, it would appear that t... »

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »

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