One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number...
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision...
Francoise will be presenting A Sustainable Future Requires Heterogeneous Integration at MicroTech 2021, the Annual IMAPS-UK Conference. Session 5 at...
From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to...
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
It’s December, and a busy three weeks of conferences until most of the semiconductor industry takes a short, two-week respite,...
Nothing vast enters the life of mortals without a curse – Sophocles, and the intro to Netflix, The Social Dilemma....
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that...
My, it has been a busy month for virtual conferences in the microelectronics space. During the week of October 5th,...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately,...
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a...
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Rochester, NY — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for...
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group...
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified...
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry...
