Latest Posts
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the...
Diving Deep into TSV Cleaning and Electroplating Processes For Heterogeneous Integration
By Jim Straus and Sally-Ann Henry, ACM Research While heterogeneous integration of multiple components and 2.5D/3D packaging techniques pair perfectly...
EV Group Heterogeneous Integration Solutions To Be Highlighted at ECTC 2024
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications....
EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration
Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in...
IFTLE 578: Why Are TSMC’s Offshore Fabs Progressing Differently?
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project...
Tapping into the Power of the Microelectronics Community
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by...
The IMAPS 2023 International Symposium Inspires Generations of Microelectronics Leaders
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
IFTLE 571: Advancements in Process Tools and EDA for Chiplets
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end...
Changes at 3D InCites: The Advisory Board Gets a Reboot and More
Fourteen years in existence, 3D InCites has been through some changes, from being a basic blogging platform focused only on...
IFTLE 565: High-Density Build-Up Substrates and SHIP Update
IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion...
ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb...Hybrid Bonding takes Heterogeneous Integration to the Next Level
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence...
A Career in Microelectronics Through the Eyes of Bill Chen
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination...
Heterogeneous IC Packaging: Building an Infrastructure
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products...
IFTLE 553: Samsung Foundry Update; Amkor/ GlobalFoundries Venture
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained...
Will 3D Packaging Extend Moore’s Law?
There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has...
