The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D” has been a topic of debate in the advanced packaging world ever since it was first added to the industry... »
Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the time to read this – it’s almost curtain time. Everything that needs to be prepped is done, and if it’s not, it’s too bad, because the show will go on! It seems like every year, there’s more and more content to choose from. And you must choose because it’s pretty much... »
Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled alongside major conferences around the globe so that as many people as possible can participate. We’ve been following the progress since the beginning. I caught up with Bill Chen, president of the IE... »
For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can achieve with innovations in 3D, advanced packaging, and other heterogeneous integration (HI) technologies. Based on the turnout at this year’s IEEE Electronics Components and Technologies Conference, which took place May 29-June 1 in San Diego, CA, it would appear that t... »
Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »
MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development, ASE US, delivering his view on Packaging Innovation for our Application-Driven World Rich’s thesis: that, desp... »
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany. All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer IZM presentation was introdu... »
A couple of years ago we may not have predicted that in 2018 there would be a growing demand for high-end chips specifically for global cryptocurrency mining. Those taking part in this search for hashes have a glimmer in their eye similar to those consumed by the hope and frenzy of a gold rush. The rush of getting to the answer first, and of course the alluring reward paid in Bitcoin, is driving p... »
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by Dan Green, DARPA, that if the powers that be had bothered reading to the top of Page 3 of Gordon Moore’s “Crammi... »
Site Design By
Recent Comments