Latest Posts - Page 3
Electronics Packaging – From Afterthought to Product Differentiator
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard...
EV Group Brings High-speed High-precision Metrology to 3D Heterogeneous Integration
EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria,...
IFTLE 502: Are Samsung and Intel challenging TSMC Dominance? AMAT Positions Itself in Advanced Packaging
Major Foundry Investments in the US Samsung, Intel, and TSMC are all making large foundry investments in the US. First...
IFTLE 501: A Look at the Semiconductor Supply Chain and More from the HI Summit
Back from our IFTLE #500 trip down memory lane, let’s continue our look at the SEMI Heterogeneous Integration Summit. We’ll...
Maximize Large Volume Failure Analysis Throughput with Parallel Processing of Laser Ablation and Plasma FIB
Determining the causes of failures in semiconductors often requires removing overlying material to expose the failed circuit element for high-resolution...
IFTLE 499: SEMI Heterogeneous Integration Summit Part 1
The SEMI Connecting Heterogeneous Systems Summit (Sept 1-3, 2021) highlighted the latest in heterogeneous integration and sensing technology advances. Let’s take...
The 3D Era is Upon Us
Building integrated circuits (ICs) in the third dimension has been taking place since trench capacitors were introduced for DRAM in...
Understanding the Nuances of Chiplet Design
Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple...
Trends in Semiconductor Manufacturing: Wafer-Level Packaging
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global...
Die-to-Wafer Bonding Steps into the Spotlight on a Heterogeneous Integration Stage
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence...
Trends and Development in Heterogeneous Integration: Advancing the Smart Digital Age with System-in-Package and Chiplet Technologies
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number... Fine-Pitch 3D Stacked Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision...
Francoise von Trapp to Speak on Heterogeneous Integration at MicroTech 2021
Francoise will be presenting A Sustainable Future Requires Heterogeneous Integration at MicroTech 2021, the Annual IMAPS-UK Conference. Session 5 at...
3D: The El Dorado of Heterogeneous Integration
From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to...TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost...ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
The Most Wonderful Time of Year for A Semiconductor Technologist
It’s December, and a busy three weeks of conferences until most of the semiconductor industry takes a short, two-week respite,...
The Semiconductor Industry’s Role in The Social Dilemma
Nothing vast enters the life of mortals without a curse – Sophocles, and the intro to Netflix, The Social Dilemma....