Latest Posts - Page 2
Brewer Science Presents Advanced Packaging Innovations at SEMICON Taiwan 2022
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader...
EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan
Minneapolis, Minnesota — August 15, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...
IFTLE 526: NIST Funds SEMI/UCLA CHIPS HIR Roadmap; China Dumps US Computers
Another Heterogeneous Integration Roadmap The UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) and SEMI have announced that they have been awarded...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
ECTC 2022: Amazing In-person Packaging Community Participation!
The 72nd IEEE Electronic Components and Technology Conference (ECTC) was held again in person from May 31st to June 3rd,...
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density...
ASE Introduces VIPack™ to Help Transform Packaging Solution Enablement
SUNNYVALE, Calif., June 1st, 2022 –Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:ASX, TAIEX:...
EV Group Lithography Solutions for Heterogeneous Integration and Wafer-level Packaging to Be Highlighted at ECTC 2022
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More...
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla....
UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration
Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics Valencia, Spain, and...
Increased U.S. Manufacturing of Microelectronics Enabled Through Mercury Systems’ Phoenix Facility Expansion
ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
How MTP Technology Improves 3D Heterogeneous Integration
High-performance computing, communications, mobile, automotive, industrial, medical, and defense systems increasingly require 3D heterogeneous integration of many diverse components to...
Advanced Packaging – Measuring Deep Etch Trenches
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic...
Another Strong Year Ahead for Hybrid Bonding Thanks to Heterogeneous Integration
While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable...
Making the Impossible Possible
Building a Better Future After a Year of Surprising Growth and Rising Demand The new year is always a wonderful...
Onto Innovation Announces Growing $500 Million Order Backlog, Including Solutions for Heterogeneous Packaging
Over $100 million in orders encompass solutions for 2.5D, 3D packaging and hybrid bonding applications WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation...
