Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory...
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...
The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology...
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least...
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in...
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is...
I usually never miss the Academy Awards, but this year I am in Germany visiting Fraunhofer IZM ASSID in Dresden...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf,...
